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Molybdenum Chromium Sputtering Target

ST0098 Molybdenum Chromium Sputtering Target, Mo/Cr

Chemical Formula: Mo/Cr
Catalog Number: ST0098
CAS Number: 7439-98-7 | 7440
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum Chromium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Molybdenum Chromium Sputtering Target (Mo/Cr)

Introduction

Molybdenum Chromium (Mo/Cr) Sputtering Target is a high-performance refractory alloy material developed for thin film applications requiring excellent thermal stability, strong adhesion, and corrosion resistance. By combining molybdenum’s high melting point and dimensional stability with chromium’s oxidation resistance and hardness, Mo/Cr alloy films provide durable and reliable performance in demanding deposition environments. These targets are widely used in microelectronics, flat panel displays, and advanced functional coatings.

Detailed Description

Our Molybdenum Chromium Sputtering Targets are produced using high-purity Mo and Cr through vacuum melting or powder metallurgy routes to ensure uniform composition and structural homogeneity. Precise control of the Mo-to-Cr ratio is essential, as it directly influences film stress, conductivity, thermal expansion behavior, and adhesion to various substrates.

The targets exhibit high density and a fine, homogeneous microstructure, minimizing arcing and particle generation during sputtering. Due to their metallic conductivity, Mo/Cr targets are compatible with DC sputtering systems, offering stable plasma conditions and consistent deposition rates. For high-power or large-area deposition systems, targets can be indium-bonded or diffusion-bonded to copper backing plates to enhance thermal management and extend operational lifetime.

Planar round, rectangular, and custom geometries are available to match a wide range of sputtering cathodes.

Applications

Molybdenum Chromium Sputtering Targets are commonly used in:

  • Gate and interconnect layers in microelectronics

  • Thin film resistors and barrier layers

  • Adhesion-promoting interlayers

  • Display panel metallization

  • High-temperature and corrosion-resistant coatings

  • Research on refractory alloy thin films

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionMo/Cr alloy (custom ratios)Controls thermal and mechanical properties
Purity99.9% – 99.99%Minimizes contamination in films
Diameter25 – 300 mm (custom available)Compatible with standard cathodes
Thickness3 – 12 mmInfluences target lifetime
Density≥ 99% theoreticalImproves sputtering stability
Sputtering ModeDC sputtering (typical)Suitable for conductive alloys
BondingUnbonded / Cu backing (optional)Enhances heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Mo/CrBalanced thermal stability & adhesionMicroelectronics & displays
Pure MolybdenumHigh melting pointHigh-temperature films
Pure ChromiumStrong corrosion resistanceDecorative & protective films
Mo/Ti AlloyGood adhesion & conductivityBarrier layers

FAQ

QuestionAnswer
Can the Mo/Cr composition be customized?Yes, alloy ratios can be tailored to specific performance requirements.
Is DC sputtering suitable?Yes, Mo/Cr is conductive and ideal for DC sputtering systems.
Are bonded targets available?Yes, copper backing plates are available for improved thermal management.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or wooden crates.

Packaging

Our Molybdenum Chromium Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each target is vacuum-sealed and carefully packed to prevent oxidation or mechanical damage during storage and transport.

Conclusion

Molybdenum Chromium (Mo/Cr) Sputtering Target offers a dependable solution for depositing refractory alloy thin films with enhanced thermal stability, adhesion, and corrosion resistance. With controlled composition, high density, and flexible customization options, it is well suited for microelectronics, display technologies, and advanced coating applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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