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VD0850 Molybdenum Diselenide Evaporation Materials, MoSe2

Catalog No.VD0850
MaterialMolybdenum Selenide (MoSe2)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity molybdenum diselenide and a diverse range of evaporation materials. We provide these materials in both powder and granule forms, and we can also customize them to meet specific requirements upon request. Whether you need standard or bespoke solutions, TFM is dedicated to delivering high-quality materials tailored to your needs.

Molybdenum Diselenide Evaporation Materials Overview

Molybdenum diselenide (MoSe2) evaporation materials are essential in various deposition processes, known for their high-purity and reliability. Produced by TFM, these selenide ceramic materials are crucial for achieving superior quality in deposited films. With an impressive purity of up to 99.9995%, TFM ensures that each batch meets stringent quality standards for consistent performance.

Related Products: Molybdenum Evaporation Materials,

Specifications of Molybdenum Diselenide Evaporation Materials

Material TypeMolybdenum Diselenide
SymbolMoSe2
Appearance/ColorDark gray
Melting Point>1200 °C
Density6.90 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications of Molybdenum Diselenide Evaporation Materials

Molybdenum diselenide is utilized in various deposition techniques such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). Its applications extend to optics, where it is employed for wear protection, decorative coatings, and display technologies.

Packaging and Handling

TFM takes special care in the packaging of molybdenum diselenide evaporation materials to ensure they are clearly labeled and protected during storage and transportation. This meticulous approach helps prevent any potential damage and guarantees the materials reach their destination in optimal condition.

Contact Information

As a premier manufacturer and supplier of high-purity molybdenum diselenide evaporation materials, TFM offers a range of forms including tablets, granules, rods, and wires. Custom forms and quantities can be arranged upon request. TFM also supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For inquiries about pricing or to request materials not listed, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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