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molybdenum-disilicide

VD0803 Molybdenum Disilicide Evaporation Materials, MoSi2

Catalog No.VD0803
MaterialMolybdenum Silicide (MoSi2)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM is a top-tier producer and supplier of premium molybdenum disilicide evaporation materials, renowned for our commitment to quality and innovation. We offer a diverse selection of evaporation materials, available in both powder and granule forms. Additionally, we can tailor our products to meet specific requirements upon request, ensuring you get exactly what you need for your applications.

MSDS File

Molybdenum Disilicide Evaporation Materials Overview

Molybdenum disilicide (MoSi₂) is a high-performance ceramic evaporation material renowned for its critical role in achieving superior deposition results. At TFM, we provide molybdenum disilicide evaporation materials with exceptional purity levels, up to 99.9995%, ensuring the highest quality films in your deposition processes.

Molybdenum Disilicide Evaporation Materials Specification

Material TypeMolybdenum Disilicide
SymbolMoSi2
Appearance/ColorGray metallic solid
Melting Point2,030 °C (3,690 °F; 2,300 K)
Density6.26 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications

Our molybdenum disilicide evaporation materials are essential in various deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

They are widely used in optics for applications such as wear protection, decorative coatings, and display technologies.

Packaging and Quality Assurance

Each batch of molybdenum disilicide evaporation material is carefully tagged and labeled to facilitate efficient identification and maintain rigorous quality control standards. We prioritize protecting the materials during storage and transportation to avoid any damage.

Contact Us

TFM stands as a premier provider of high-purity molybdenum disilicide evaporation materials. We offer various shapes including tablets, granules, rods, and wires, with custom forms and quantities available upon request. Additionally, we supply a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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