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VD0563 Molybdenum Evaporation Materials, Mo

Material Type: Molybdenum
Symbol: Mo
Purity: 99.9% ~ 99.95%
Shape: Powder/ Granule/ Custom-made

TFM excels in producing and supplying premium high-purity molybdenum evaporation materials, alongside a broad range of other evaporation substances. Our offerings include both powder and granule forms, with options for customization to meet specific requirements.

 

Molybdenum Evaporation Material Description

Molybdenum (Mo) is a gray-metallic element renowned for its exceptional melting point, which is the third highest among all elements, after tungsten and tantalum. With a melting point of 2,617°C, a density of 10.2 g/cc, and a vapor pressure of 10^-4 Torr at 2,117°C, molybdenum exhibits remarkable strength and stability under high-heat conditions. Although it is found in various oxidation states in minerals, it does not exist naturally in its free form. Its robust properties make it ideal for alloying with other metals to produce corrosion-resistant materials used in tools, aircraft components, and electrical contacts.

In deposition processes, high-purity molybdenum evaporation materials are essential for achieving high-quality deposited films. TFM specializes in producing molybdenum evaporation materials with purity levels up to 99.95%, supported by stringent quality assurance measures to ensure reliable product performance.

molybdenum evaporation materials

Molybdenum Evaporation Material Specification

Material TypeMolybdenum
SymbolMo
Color/AppearanceGrey, Metallic
Density10280 kg/m3
Melting Point 2,617 °C
Coefficient of Thermal Expansion4.8 x 10-6/K
SynonymsMo Pellets, Mo Pieces, Mo Evaporation Pellet, Molybdenum Pellets, Molybdenum Pieces, Molybdenum Evaporation Pellet

Molybdenum Evaporation Material Application

Molybdenum evaporation materials are utilized in various advanced applications, including:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD) to produce high-quality thin films.
  • Optics: Applied in the creation of wear-resistant coatings, decorative finishes, and high-performance display technologies.

Molybdenum Evaporation Material Packaging

We carefully handle our molybdenum evaporation materials during storage and transportation to prevent any damage. This meticulous approach ensures that the quality and integrity of our products are preserved in their original condition.

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TFM offers molybdenum evaporation materials in a range of forms, purities, sizes, and price points. We specialize in high-purity e-beam evaporation materials, characterized by optimal density and minimal average grain sizes. For current pricing on evaporation pellets and other deposition materials not listed, please contact us with your inquiry.

Ordering Table

Material Size Quantity Purity Notes Part Number
Molybdenum 1/4" Dia. x 1/2" Length 1 lb. 99.95% EVMMO35QXH
Molybdenum 1/4" Dia. x 1/4" Length 1 lb. 99.95% EVMMO35QXQ
Molybdenum 1/4" Dia. x 1/4" Length 25 g 99.95% EVMMO35QXQA
Molybdenum 1/4" Dia. x 1/4" Length 50 g 99.95% EVMMO35QXQB
Molybdenum 1/4" Dia. x 1/4" Length 100 g 99.95% EVMMO35QXQD
Molybdenum 1/8" Dia. x 1/4" Length 1 lb. 99.95% EVMMO35EXQ
Molybdenum 1/8" Dia. x 1/8" Length 1 lb. 99.95% EVMMO35EXE
Molybdenum 1/8" Dia. x 1/8" Length 100 g 99.95% EVMMO35EXED
Molybdenum 1/8" Dia. x 1/8" Length 250 g 99.95% EVMMO35EXEJ
Molybdenum Approx. 1/4" x 1/4" Pieces Per Gram 99.95% EVMMO35SPL10

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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