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Molybdenum Mo Rotary Sputtering Target

Molybdenum (Mo) Rotary Sputtering Target

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Molybdenum Mo Rotary Sputtering Target

TFM offers high-quality Molybdenum Mo rotary sputtering targets, ideal for thin-film deposition in various advanced applications, including semiconductors, coatings, and electronics. Molybdenum Mo targets are known for their high melting point, excellent thermal conductivity, and superior strength, making them ideal for high-performance thin-film applications in environments that require extreme thermal and mechanical stability.

The rotary sputtering target design ensures efficient and uniform deposition of Molybdenum Mo films, which are commonly used in electronic devices, solar cells, and high-temperature coatings. Molybdenum Mo films are highly valued for their ability to withstand high temperatures and oxidizing conditions, making them suitable for applications in aerospace, energy storage, and industrial processes. Additionally, Molybdenum disulfide (MoS₂) films are widely used for their lubricant properties and are ideal for tribological applications.

Molybdenum Mo films are also frequently used in electrode applications, thin-film transistors (TFTs), and conductive layers in semiconductor devices. Molybdenum is essential in solar energy production, where it is used in back contacts and electrical interconnects due to its high conductivity and stability. Molybdenum Mo films can also be employed in hard coatings for cutting tools and industrial machinery due to their wear resistance and low friction characteristics.

TFM provides customized Molybdenum Mo rotary sputtering targets, ensuring precise control over material composition and purity to meet the specific requirements of advanced applications. These targets deliver consistent, high-quality deposition results for industries such as electronics, aerospace, energy storage, and solar energy.

Our Molybdenum Mo rotary sputtering targets are manufactured to the highest standards, offering superior material quality and consistent sputtering performance. With low impurity levels, high density, and optimized sputtering characteristics, TFM’s Molybdenum Mo targets are ideal for producing high-performance thin films for next-generation technologies.

Specifications

MaterialsMolybdenum Rotary Sputtering Target
SymbolMo
Purity99.95%
Theoretical Density (g/cc)2.7
Melting Point (°C)10.2
Production MethodSpraying Type, Monolithic Type (HIP), Bonded Type (HIP)
Backing TubeTitanium, Stainless Steel
SizeAs per customer’s drawings
Relative Density>= 99%
Grain Sizes<100 µm
Annual Capacity1000 tons

Applications

  • Thin Film Photovoltaic Solar Industry
  • Semiconductor Electronics Industry
  • Flat Panel Display Industry

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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