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VD0634 Molybdenum Titanium Evaporation Materials, Mo/Ti

Catalog No.VD0634
MaterialMolybdenum Titanium (Mo/Ti)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM specializes in the production of high-purity molybdenum titanium evaporation materials, ensuring top-notch reliability through rigorous quality assurance processes. Our materials are available in a range of forms, including tablets, granules, pellets, and powder, to suit diverse application needs.

MSDS File

Molybdenum Titanium Evaporation Materials Overview

TFM produces high-purity molybdenum titanium evaporation materials, an advanced alloy of molybdenum (Mo) and titanium (Ti). Our materials, with purity levels up to 99.9995%, are essential for ensuring the quality of deposited films in various applications. We employ stringent quality assurance measures to guarantee the reliability and performance of our products.

Applications

Molybdenum titanium evaporation materials are employed in:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging

We meticulously handle our molybdenum titanium evaporation materials to avoid any damage during storage and transportation, preserving their quality in their original state.

Contact Us

As a leading manufacturer and supplier, TFM offers molybdenum titanium evaporation materials in various forms, including tablets, granules, rods, and wires. We also provide customized shapes and quantities upon request. In addition to evaporation materials, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and further information, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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