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ST0422 Molybdenum Tungsten Sputtering Target, Mo/W

Chemical Formula: Mo/W
Catalog Number: ST0422
CAS Number:870196-77-3
Purity: 99.9%, 99.95%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum Tungsten sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Molybdenum Tungsten Sputtering Target Description

The molybdenum tungsten sputtering target is a type of alloy sputtering target composed of molybdenum and tungsten.

MolybdenumMolybdenum is a chemical element with the symbol “Mo” and atomic number 42. The name “molybdenum” originates from the Greek word ‘molybdos,’ meaning lead. It was first mentioned in 1778 and observed by Carl Wilhelm Scheele. The isolation was later accomplished and announced by Peter Jacob Hjelm. Molybdenum is located in Period 5 and Group 6 of the periodic table, belonging to the d-block elements. Its relative atomic mass is approximately 95.94 Daltons, with the number in parentheses indicating the uncertainty.

Related Product: Molybdenum Sputtering Target

TungstenTungsten, also known as wolfram or wolframium, is a chemical element with the symbol “W” and atomic number 74. The name “tungsten” originates from the Swedish words ‘tung sten,’ meaning heavy stone. The element was first mentioned in 1781 and observed by Carl Wilhelm Scheele, while its isolation was later accomplished and announced by Juan José and Fausto Elhuyar. Tungsten is located in Period 6 and Group 6 of the periodic table, belonging to the d-block elements. Its relative atomic mass is approximately 183.84 Daltons, with the number in parentheses indicating the uncertainty.

Related Product: Tungsten Sputtering Target

Molybdenum Tungsten Sputtering Target Specification

Material TypeMolybdenum Tungsten
SymbolMo/W
Color/AppearanceMetallic Solid
Melting PointN/A
Boiling PointN/A
DensityN/A
Type of BondIndium, Elastomer
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Molybdenum Tungsten Sputtering Target Bonding Services

Specialized bonding services for Molybdenum Tungsten Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Our molybdenum tungsten sputter coater target is carefully packaged in a plastic vacuum bag to prevent damage during storage and transportation, ensuring the product remains in its original condition. Additionally, the Certificate of Analysis (COA) for the raw material is included with the product to verify its quality and specifications.

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TFM offers Molybdenum Tungsten Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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