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ST0333 Neodymium Boride Sputtering Target, NdB6

Chemical Formula: NdB6
Catalog Number: ST0333
CAS Number: 12045-64-6
Purity: 99.50%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Neodymium Boride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Neodymium Boride Sputtering Target Description

A Neodymium Boride Sputtering Target is a type of ceramic material composed of neodymium and boron, used in sputtering processes. This target is typically employed in thin film deposition and various specialized applications due to the unique properties of the neodymium-boron combination.

NeodymiumNeodymium is a chemical element with the symbol “Nd” and an atomic number of 60. The name “neodymium” originates from the Greek words ‘neos didymos,’ meaning new twin. It was first mentioned in 1885 and observed by Carl Auer von Welsbach. Neodymium is located in Period 6 and Group 3 of the periodic table, belonging to the f-block elements. Its relative atomic mass is approximately 144.242 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Neodymium Sputtering Target

BoronBoron is a chemical element with the symbol “B” and an atomic number of 5. The name “boron” originates from the Arabic word ‘buraq,’ which referred to borax. It was first mentioned in 1808 and observed by Louis-Joseph Gay-Lussac and Louis Jacques Thénard. The isolation of boron was later accomplished and announced by Humphry Davy. Boron is located in Period 2 and Group 13 of the periodic table, classified within the p-block elements. Its relative atomic mass is approximately 10.811 Daltons, with the number in parentheses indicating a margin of uncertainty.

Packaging

Our Neodymium Boride Sputtering Targets are carefully packaged in plastic vacuum bags to prevent damage during storage and transportation and to preserve the quality of our products in their original condition. Additionally, the Certificate of Analysis (COA) of the raw material is included with the product packaging to ensure quality assurance and traceability.

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TFM offers  Neodymium Boride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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