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ST0178A Neodymium Gadolinium Oxide Sputtering Targets (NdGdO3)

MSDS File
Material TypeNeodymium Gadolinium Oxide
SymbolNdGdO3
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Theoretical Density (g/cc)N/A
Water SolubilityInsoluble
SputterRF, RF-R, DC
Type of BondIndium,

Neodymium Gadolinium Oxide Sputtering Targets

Neodymium Gadolinium Oxide (NdGaO₃) sputtering targets are advanced materials designed to meet the needs of modern technology applications. With their high-purity and reliable performance, these targets are used in the deposition of high-quality thin films in industries such as semiconductor, optics, and electronics.

Specifications

  • Purity: 99.9%

  • Circular Targets: Diameter ≤ 14 inches, Thickness ≥ 1mm

  • Block Targets: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Key Features and Advantages

  • High Purity: TFM’s Neodymium Gadolinium Oxide Sputtering Targets come with a purity of 99.9%, ensuring exceptional quality and consistency for reliable performance in thin film deposition.

  • Customizable Sizes: These targets are available in custom sizes, offering flexibility for different applications, ranging from semiconductor manufacturing to research and development.

  • Excellent Uniformity: The cold-pressing and sintering process ensures a high-density, uniform target, providing consistent deposition results.

  • Elastomer Bonding: Targets are elastomer bonded to the backing plate to enhance their durability and handling during sputtering operations.

  • Vacuum Compatibility: All targets are thoroughly cleaned and carefully packaged to ensure they remain free of contaminants, making them suitable for vacuum deposition environments.

Applications

  • Ferroelectric Materials: Neodymium Gadolinium Oxide is an ideal choice for use in ferroelectric applications, particularly in the development of non-volatile memories and other advanced electronic devices.

  • Gate Dielectric: These targets are well-suited for creating gate dielectrics in CMOS (Complementary Metal-Oxide-Semiconductor) technologies, which are widely used in integrated circuits

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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