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ST0031 Neodymium Sputtering Target, Nd

Chemical Formula: Nd
Catalog Number: ST0031
CAS Number: 7440-00-8
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Neodymium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Neodymium Sputtering Target Description

Neodymium

The neodymium sputtering target is made from high-purity neodymium metal. Neodymium, symbolized as “Nd,” is a chemical element named from the Greek words ‘neos didymos,’ meaning new twin. It was first identified in 1885 by A. von Welsbach. With an atomic number of 60, neodymium is located in Period 6 and Group 3 of the periodic table, within the f-block. Its relative atomic mass is 144.242(3) Daltons, with the number in parentheses indicating the measurement’s uncertainty.

Neodymium Sputtering Target Specification

Material Type Neodymium
Symbol Nd
Color/Appearance Silvery, Metallic
Melting Point 1244°C
Density ~7.3 g/cm3
Thermal Conductivity 0.0781 W/cm/K @ 25 °C
Electrical Resistivity 185.0 microhm-cm @ 25°C
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Neodymium Sputtering Target Application

Neodymium sputtering targets are widely utilized in thin film deposition for applications including decoration, semiconductors, displays, LEDs, and photovoltaic devices. They are also essential in functional coatings, optical information storage, the glass coating industry—including automotive and architectural glass—and optical communications.

Beyond sputtering targets, neodymium has several other significant uses:

  • Glasses and Ceramics: Neodymium is used to color glass and ceramics.
  • Neodymium Magnets: Known for their strength, these magnets are crucial in various high-tech applications.
  • Lighter Flints and Steel Making: Neodymium is a key component in the production of lighter flints and steel alloys.

Neodymium Sputtering Target Packaging

Our Neodymium Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Neodymium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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