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ST0298 Nickel Boride Sputtering Target, Ni2B

Chemical Formula: Ni2B
Catalog Number: ST0298
CAS Number: 12007-01-1
Purity: >99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Nickel Boride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Nickel Boride Sputtering Target Description

A Nickel Boride Sputtering Target is a type of ceramic material composed of nickel and boron, commonly used in sputtering processes. This target is typically utilized in thin film deposition and various specialized applications due to the unique properties of the nickel-boron combination.

NickelNickel is a chemical element with the symbol “Ni” and an atomic number of 28. The name “nickel” is derived from the German word ‘kupfernickel,’ which means “devil’s copper” or “St. Nicholas’s copper.” It was first identified in 1751 by Axel Fredrik Cronstedt, who also accomplished its isolation. Nickel is located in Period 4 and Group 10 of the periodic table, belonging to the d-block elements. Its relative atomic mass is approximately 58.6934 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Nickel Sputtering Target

BoronBoron, symbolized as “B” with an atomic number of 5, derives its name from the Arabic word ‘buraq,’ referring to borax. It was first noted in 1808 by scientists Louis-Joseph Gay-Lussac and Louis-Jacques Thénard. The successful isolation of boron was later achieved and announced by Sir Humphry Davy. Boron is located in Period 2 and Group 13 of the periodic table, classified within the p-block elements. Its relative atomic mass is approximately 10.811 Daltons, with the number in parentheses indicating a margin of uncertainty.

Nickel Boride Sputtering Target Specification

Compound FormulaNi2B
AppearanceSolid
Density7.9 g/cm3
Melting PointN/A
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Nickel Boride Sputtering Target Application

The Nickel Boride Sputtering Target is utilized in a wide range of applications, including thin film deposition and decorative coatings. It is commonly employed in the semiconductor industry, display technologies, and the production of LEDs and photovoltaic devices. Additionally, this material is significant in functional coatings, the optical information storage industry, and glass coating applications for automotive and architectural purposes, as well as in optical communication technologies.

Nickel Boride Sputtering Target Packing

Our Nickel Boride Sputtering Targets are carefully tagged and labeled on the exterior to ensure easy identification and maintain high standards of quality control. We take extensive precautions to protect these targets from potential damage during storage and transportation, ensuring they arrive in perfect condition.

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TFM offers Nickel Boride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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