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Nickel Chromium Silicon Evaporation Materials

VD0636 Nickel Chromium Silicon Evaporation Materials, Ni/Cr/Si

Catalog No.VD0636
MaterialNickel Chromium Silicon
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM stands as a top-tier manufacturer and supplier, specializing in high-purity nickel-chromium-silicon evaporation materials, alongside a broad array of other evaporation products. We provide these materials in both powder and granule forms, with customized options available to meet specific needs.

MSDS File

Nickel Chromium Silicon Evaporation Materials Overview

TFM’s nickel-chromium-silicon evaporation materials are specialized alloy products composed of nickel (Ni), chromium (Cr), and silicon (Si). These high-purity materials are crucial in deposition processes, ensuring that the resulting films are of superior quality. At TFM, we focus on producing evaporation materials with purities of up to 99.9995%, employing rigorous quality control measures to ensure the highest level of product reliability.

Related Products: Nickel Evaporation Materials, Chromium Evaporation Materials, Silicon Evaporation Materials

Applications of Nickel Chromium Silicon Evaporation Materials

TFM’s nickel-chromium-silicon evaporation materials are utilized in a variety of high-precision applications, including:

  • Deposition Processes: Integral to semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD) techniques.
  • Optical Applications: Used in wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our nickel-chromium-silicon evaporation materials are meticulously packaged to prevent any damage during storage and transportation, ensuring that the materials arrive in perfect condition, ready for immediate use.

Contact Us

TFM is a premier provider of high-purity nickel-chromium-silicon evaporation materials, available in a variety of shapes such as tablets, granules, rods, and wires. We also offer custom forms and quantities to meet your specific requirements. In addition, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or inquiries about materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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