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Nickel Cobalt Sputtering Target

ST0998 Nickel Cobalt Sputtering Target, Ni-Co

Chemical FormulaNi-Co
Catalog No.ST0998
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

With extensive expertise in materials science, TFM presents Nickel Cobalt Sputtering Targets renowned for their exceptional purity. We are committed to providing cost-effective solutions and customized options that meet the exacting needs of nanotechnology and thin-film deposition.

MSDS File

Nickel Cobalt Sputtering Target Description

Nickel Cobalt Sputtering Targets offer unique properties that are highly beneficial for various technological applications. Renowned for their exceptional purity, these targets are essential for precise thin-film deposition processes. The Nickel Cobalt alloy ensures superior conductivity, making them ideal for advanced electronic and semiconductor manufacturing. Additionally, they provide excellent corrosion resistance, which enhances their durability and reliability in demanding conditions. This combination of attributes makes Nickel Cobalt Sputtering Targets indispensable for cutting-edge nanotechnology applications, supporting the development of efficient and reliable electronic devices and semiconductor components.

Related Product: Aluminum Nickel Sputtering Target, Chromium Nickel Sputtering Target

Nickel Cobalt Sputtering Target Specifications

Compound FormulaNi-Co
AppearanceSilver Metallic Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Nickel Cobalt Sputtering Target Handling Notes

Indium bonding is recommended for Nickel Cobalt Sputtering Targets due to certain characteristics that pose challenges during sputtering, such as brittleness and low thermal conductivity. The material’s low thermal conductivity and susceptibility to thermal shock further underscore the need for proper bonding to ensure optimal performance during the sputtering process.

Nickel Cobalt Sputtering Target Application

Nickel Cobalt Sputtering Targets are widely used across advanced technologies, primarily in thin-film deposition processes. They are crucial for producing electronic devices and semiconductor components, thanks to their exceptional purity which ensures precise and efficient coating. Their superior conductivity makes them ideal for manufacturing high-performance electronic circuits and thin films. Additionally, their corrosion resistance enhances the durability and reliability of coatings. Overall, Nickel Cobalt Sputtering Targets are essential for improving the functionality and performance of various electronic and semiconductor devices.

Nickel Cobalt Sputtering Target Packaging

We meticulously handle our Nickel Cobalt Sputtering Target during storage and transportation to ensure it retains its original quality and condition.

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TFM offers Nickel Cobalt Sputtering Targets in a range of forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with maximum density and minimal average grain sizes, making them ideal for semiconductor applications, chemical vapor deposition (CVD), and PVD processes for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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