Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Nickel Ferrite Sputtering Target

ST0462 Nickel Ferrite Sputtering Target, NiFe2O4

Chemical Formula: NiFe2O4
Catalog Number: ST0462
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Nickel Ferrite sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Nickel Ferrite Sputtering Target Description

Nickel ferrite sputtering target from TFM is an alloy sputtering material composed of nickel (Ni) and iron (Fe).

Nickel

Nickel is a chemical element derived from the German word ‘kupfernickel,’ meaning either devil’s copper or St. Nicholas’s copper. It was first mentioned in 1751 and observed by F. Cronstedt, who also accomplished and announced its isolation. “Ni” is the canonical chemical symbol of nickel. It has an atomic number of 28, situated in Period 4 and Group 10 of the periodic table, belonging to the d-block elements. The relative atomic mass of nickel is 58.6934(2) Daltons, with the number in parentheses indicating the margin of uncertainty.

iron

Iron, also known as ferrum, is a chemical element derived from the Anglo-Saxon name “iren” (Latin: “ferrum”). It has been in use since before 5000 BC. The canonical chemical symbol for iron is “Fe.” It holds the atomic number 26 in the periodic table and is located in Period 4 and Group 8, belonging to the d-block. The relative atomic mass of iron is 55.845(2) Daltons, with the number in parentheses indicating the uncertainty.

Related Product: Nickel Sputtering Target, Iron Sputtering Target

Nickel Ferrite Sputtering Target Specification

Material Type Nickel Ferrite
Symbol NiFe2O4
Color/Appearance Gray solid
Melting Point N/A
Density 5.4 g/cm3
Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Nickel Ferrite Sputtering Target Packaging

Our nickel ferrite sputter targets are meticulously handled to prevent any damage during storage and transportation. This careful packaging ensures the quality of our products is maintained in their original condition. Each target is clearly tagged and labeled externally to facilitate efficient identification and quality control.

Get Contact

TFM offers Nickel Ferrite Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0462 Nickel Ferrite Sputtering Target, NiFe2O4”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top