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Nickel Gallium Sputtering Target

ST0997 Nickel Gallium Sputtering Target, Ni/Ga

TFM provides high-purity Nickel Gallium Sputtering Targets at competitive prices. Leveraging our extensive materials science expertise, we offer top-quality targets for nanotechnology and thin-film deposition that meet the highest industry standards. Trust our exceptional products for precise and reliable film deposition.

MSDS File

Nickel Gallium Sputtering Target Description

The Nickel Gallium Sputtering Target is an essential material for thin-film deposition processes. Comprising a high-purity alloy of nickel and gallium, this target offers exceptional thermal stability, ensuring reliable performance even under challenging conditions. Its high electrical conductivity facilitates efficient electron transfer, making it ideal for semiconductor manufacturing and electronic device fabrication. Additionally, the Nickel Gallium Sputtering Target provides excellent adhesion to substrates, resulting in durable and dependable thin films. Its versatility extends to various industries, including optical coatings and magnetic storage devices. Using this target ensures precise and uniform film deposition, contributing to the production of high-performance electronic and optical devices.

Related Product: Aluminum Nickel Sputtering Target, Chromium Nickel Sputtering Target

Nickel Gallium Sputtering Target Specifications

Compound FormulaNi/Ga
AppearanceSilver Grey Target
Density8.53-8.99 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Nickel Gallium Sputtering Target Handling Notes

Indium bonding is recommended for the Nickel Gallium Sputtering Target due to certain characteristics that can complicate sputtering, such as brittleness and low thermal conductivity. The target’s low thermal conductivity and susceptibility to thermal shock further highlight the need for appropriate bonding to ensure optimal performance during the sputtering process.

Nickel Gallium Sputtering Target Application

Semiconductor Manufacturing: The Nickel Gallium Sputtering Target is crucial in semiconductor manufacturing. It is used to deposit metal oxide films, metal stacked structures, and conductive layers for the production of transistors, capacitors, and other electronic devices.

Optical Coatings: This target is employed to create optical coatings for mirrors, filters, and lenses. Its excellent optical properties and high reflectivity enhance the efficiency and performance of optical devices.

Magnetic Memory Devices: In magnetic memory devices, the Nickel Gallium Sputtering Target is used to produce magnetic films, such as those for read/write heads in disk drives and magnetic layers in memory storage.

Other Applications: The material is also utilized for preparing conductive coatings, anti-corrosion coatings, and various functional coatings. It finds applications across electronics, optics, materials science, and other fields.

Nickel Gallium Sputtering Target Packaging

We take great care in handling our Nickel Gallium Sputtering Target during storage and transportation to ensure it maintains its original quality and condition.

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TFM provides Nickel Gallium Sputtering Targets in a range of forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with maximum density and minimal average grain sizes, making them ideal for use in semiconductor applications, chemical vapor deposition (CVD), and PVD processes for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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