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VD0640 Nickel Manganese Evaporation Materials, Ni/Mn

Catalog No.VD0640
MaterialNickel Manganese (Ni/Mn)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier specializing in high-purity nickel-manganese evaporation materials, along with a broad selection of other evaporation products. We offer these materials in both powder and granule forms, with custom options available to meet specific requirements.

MSDS File

Nickel Manganese Evaporation Materials Overview

TFM offers high-purity nickel-manganese evaporation materials, an alloy consisting of nickel (Ni) and manganese (Mn). These materials are critical in deposition processes, ensuring the production of high-quality films. TFM is dedicated to delivering evaporation materials with purities reaching up to 99.9995%, supported by rigorous quality control processes to guarantee the reliability and performance of our products.

Related Products: Nickel Evaporation Materials, Manganese Evaporation Materials

Applications of Nickel Manganese Evaporation Materials

Nickel-manganese evaporation materials from TFM are used in a variety of specialized applications, including:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Applications: Utilized in wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our nickel-manganese evaporation materials are packaged with great care to prevent any damage during storage and transportation, ensuring they maintain their high quality and are ready for use.

Contact Us

TFM is a leading supplier of high-purity nickel-manganese evaporation materials, available in various shapes such as tablets, granules, rods, and wires. We also offer customized forms and quantities to suit your specific needs. Additionally, TFM provides a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or inquiries about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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