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Nickel Manganese Gallium Sputtering Target

Nickel Manganese Gallium Sputtering Target, NiMnGa

Nickel Manganese Gallium Sputtering Target

Introduction

Nickel Manganese Gallium Sputtering Target is a specialized material used for fabricating thin films with tunable magnetic, electronic, and shape-memory characteristics. As a member of the Heusler alloy family, Ni-Mn-Ga enables functional coatings for sensors, actuators, magneto-mechanical devices, and research on smart materials. Its unique phase transformation behavior makes it valuable in advanced R&D environments and high-precision industrial applications.

Detailed Description

Nickel Manganese Gallium (commonly written as Ni₅₀Mn₃₀Ga₂₀ or customized compositions) is known for its ferromagnetic shape-memory effect, allowing thin films to exhibit controlled deformation under magnetic fields. When formed into sputtering targets, this alloy must maintain uniform elemental distribution, high density, and a stable grain structure to ensure consistent deposition performance.

Typical targets are produced via vacuum melting, hot pressing, or arc-melting followed by precise machining. These processes minimize porosity and help achieve a smooth sputtering behavior with fewer particles during deposition. Depending on customer requirements, targets can be supplied as monolithic discs or bonded to copper backing plates to improve heat-transfer efficiency during high-power sputtering.

Key characteristics include:

  • Stable phase composition supporting functional magnetic and shape-memory thin films.

  • High density and uniform microstructure ensuring smooth deposition.

  • Customizable stoichiometry for specialized magneto-mechanical R&D.

  • Optional copper-backing bonding for lower thermal resistance and enhanced durability.

Applications

Nickel Manganese Gallium Sputtering Target is widely used in:

  • Smart material research (ferromagnetic shape-memory systems)

  • Actuators and micro-actuator thin films

  • Magneto-strictive and magneto-elastic coatings

  • MEMS devices and micro-robotics components

  • Sensors for magnetic or mechanical detection

  • Academic and industrial R&D on Heusler alloys

  • Functional thin films requiring magnetic-field-controlled deformation

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity reduces impurities and improves film uniformity
CompositionNi₅₀Mn₃₀Ga₂₀ (customizable)Determines magnetic and shape-memory performance
Diameter25 – 300 mmFits PVD sputtering systems of various sizes
Thickness3 – 6 mmAffects sputtering rate and stability
BondingCopper backing plate (optional)Enhances heat dissipation and prevents cracking

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Nickel Manganese GalliumMagnetic shape-memory behaviorSmart material thin films, sensors
Nickel ManganeseStrong magnetic responseMagnetic coatings, spintronics
Nickel GalliumHigh corrosion resistanceStructural coatings, electronics
NiTi (Nitinol)Thermal shape-memory effectBiomedical actuators

FAQ

QuestionAnswer
Can the target be customized?Yes, composition, purity, density, and dimensions can be tailored.
Do you offer copper-backing bonding?Yes, Cu-backed targets are available for high-power sputtering.
What packaging is used?Vacuum-sealed with foam protection in export-safe cartons or wooden crates.
What industries use this material?MEMS, robotics, magnetic actuators, R&D laboratories, and smart-material development.
Can special stoichiometry be produced?Yes, Ni-Mn-Ga targets can be manufactured with custom elemental ratios.

Packaging

Our Nickel Manganese Gallium Sputtering Targets are vacuum-sealed and clearly labeled for easy identification and safe storage. Each target is cushioned with shock-absorbing materials and packed in export-ready cartons or wooden crates to protect against contamination and mechanical damage during transportation.

Conclusion

Nickel Manganese Gallium Sputtering Target provides a reliable solution for developing advanced functional thin films with magnetic shape-memory properties. With stable composition, consistent density, and full customization options, it serves both research laboratories and industrial PVD users seeking high-performance deposition materials.

For detailed specifications or a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

Ni₅₀Mn₃₀Ga₂₀ Target 4" Ø4"×3 mm, Ni₅₀Mn₃₀Ga₂₀ Target 3" Ø3"×3 mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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