Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
🔍
nickel-oxide-nio-sputtering-target-removebg-preview

ST0179 Nickel Oxide Sputtering Target, NiO

Chemical Formula: NiO
Catalog Number: ST0179
CAS Number: 1313-99-1
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Nickel Oxide (NiO) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Nickel Oxide Sputtering Target Description

The Nickel Oxide Sputtering Target from TFM is an oxide sputtering material composed of nickel (Ni) and oxygen (O). This material is commonly used in various applications, including thin-film deposition and electronic components.

Nickel

Nickel, symbolized as “Ni,” is a chemical element whose name originates from the German word ‘kupfernickel,’ meaning either “devil’s copper” or “St. Nicholas’s copper.” It was first mentioned and observed by F. Cronstedt in 1751, who also accomplished and announced its isolation. Nickel has an atomic number of 28 and is situated in Period 4, Group 10 of the periodic table, within the d-block. Its relative atomic mass is 58.6934(2) Dalton, with the number in brackets indicating the measurement uncertainty. Nickel is commonly used in alloys, plating, and as a catalyst in various chemical processes.

Related Product: Nickel Sputtering Target

OxygenOxygen, represented by the symbol “O,” is a chemical element that derives its name from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first described and observed by W. Scheele in 1771, who also successfully isolated it. Oxygen has an atomic number of 8, positioned in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the uncertainty. Oxygen is a vital element for life, playing a critical role in respiration, combustion, and various chemical reactions. It is also a significant component of water, many organic compounds, and the Earth’s atmosphere.

Nickel Oxide Sputtering Target Specification

Material TypeNickel Oxide
SymbolNiO
Color/AppearanceSolid
Melting Point1955 °C
Density6.67 g/cm³
Type of BondIndium bonding
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Nickel Oxide Sputtering Target Handling Notes

Specialized bonding services for Nickel Oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Our Nickel Oxide (NiO) Sputtering Target is meticulously tagged and labeled externally to ensure efficient identification and maintain rigorous quality control standards. We take great care during storage and transportation to prevent any damage, ensuring that the targets remain in optimal condition for high-performance use in various applications.

Get Contact

TFM offers Nickel Oxide (NiO) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
en en