Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Nickel Oxide Sputtering Target

ST0179 Nickel Oxide Sputtering Target, NiO

Chemical Formula: NiO
Catalog Number: ST0179
CAS Number: 1313-99-1
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Nickel Oxide (NiO) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

COA_NIOLI2O

Nickel Oxide Sputtering Target

Introduction

The Nickel Oxide (NiO) Sputtering Target from Thin Film Materials (TFM) is a high-performance ceramic material designed for thin film deposition. Nickel oxide is a p-type semiconductor with a wide bandgap and excellent chemical stability, making it an important material for electronic, optical, and catalytic applications. When fabricated into sputtering targets, NiO provides uniform thin films with controlled electrical and optical properties, suitable for both industrial production and advanced research.

Detailed Description

Nickel oxide sputtering targets are manufactured with high density and purity, typically 99.9% (3N) to 99.99% (4N). This ensures minimal contamination, reliable sputtering performance, and high-quality thin films.

  • Chemical Formula: NiO

  • Appearance: Green to black ceramic solid

  • Density: ~6.67 g/cm³

  • Melting Point: 1,955 °C

  • Crystal Structure: Cubic (NaCl-type)

TFM provides NiO sputtering targets in various shapes, including discs, rectangular plates, and custom geometries. We also offer bonding services with copper or titanium backing plates, which improve thermal conductivity, reduce stress, and extend target lifetime.

Applications

Nickel oxide sputtering targets are widely used in:

  • Semiconductors: p-type transparent conductive films

  • Electrochromic devices: smart windows and energy-efficient displays

  • Gas sensors: detection of hydrogen, carbon monoxide, and volatile compounds

  • Photovoltaics: hole transport layers in perovskite and dye-sensitized solar cells

  • Catalysis: thin film catalysts for electrochemical and photocatalytic reactions

  • R&D: advanced oxide electronics and functional coatings

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity improves thin film consistency
Diameter25 – 150 mm (custom up to 300 mm)Compatible with a wide range of sputtering systems
Thickness3 – 6 mmInfluences sputtering rate and film thickness
Bonding OptionsIndium / ElastomerEnhances adhesion and thermal stability
Backing PlateCopper / TitaniumImproves heat transfer and structural support

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Nickel Oxide (NiO)P-type semiconductor, stabilityTransparent conductive films, sensors
Zinc Oxide (ZnO)N-type semiconductor, low costTransparent electronics, photovoltaics
Tin Oxide (SnO₂)High optical transparencyGas sensors, displays

FAQ

QuestionAnswer
Can Nickel Oxide sputtering targets be customized?Yes, TFM offers custom diameters, thicknesses, and bonded backing plates.
Do you provide bonding services?Yes, indium and elastomer bonding are available to improve performance.
How are the targets packaged?Each NiO target is vacuum-sealed, cushioned with protective foam, and shipped in export-safe cartons or crates.
Which industries use NiO targets most?Electronics, energy, display technologies, sensor manufacturing, and materials research.

Packaging

All Nickel Oxide sputtering targets are vacuum-sealed and securely packaged to prevent contamination and damage during shipping. Protective foam and export-approved cartons or wooden crates are used to ensure safe delivery worldwide.

Conclusion

The Nickel Oxide (NiO) Sputtering Target from TFM delivers reliable performance for thin film deposition, with excellent stability, high purity, and customizable dimensions. Whether used in semiconductors, energy devices, or research, our NiO targets ensure consistent quality and long-term reliability.

For detailed specifications, pricing, and custom orders, please contact us at sales@thinfilmmaterials.com.

Nickel Oxide Sputtering Target Handling Notes

Specialized bonding services for Nickel Oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Order Now

NiO:Li₂O target 4N 98.96:1.04 wt% ø76.2×3mm Indium Bonded 3mm Cu B/Plate

Reviews

There are no reviews yet.

Be the first to review “ST0179 Nickel Oxide Sputtering Target, NiO”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top