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nickel-silicide

VD0805 Nickel Silicide Evaporation Materials, NiSi2

Catalog No.VD0805
MaterialNickel Silicide (NiSi2)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM excels in manufacturing and supplying high-purity nickel silicide evaporation materials, along with a diverse selection of other evaporation materials. We provide these materials in both powder and granule forms, with options for custom formulations available upon request.

MSDS File

Nickel Silicide Evaporation Materials: Description

Nickel silicide evaporation material, identified by the chemical formula NiSi2, is a high-performance silicide ceramic used in various deposition processes. This material is essential for achieving top-quality films in deposited applications. TFM produces nickel silicide evaporation materials with remarkable purity levels, reaching up to 99.9995%. Our comprehensive quality assurance processes ensure that each product maintains the highest standards of reliability.

Nickel Silicide Evaporation Materials Specification

Material TypeNickel silicide
SymbolNiSi2
Melting Point1,255 °C (2,291 °F; 1,528 K)
Density7.40 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications of Nickel Silicide Evaporation Materials

Nickel silicide evaporation materials are widely used in deposition techniques such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are primarily utilized in optics for applications including wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our nickel silicide evaporation materials are meticulously tagged and labeled to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

Contact TFM

As a leading provider of high-purity nickel silicide evaporation materials, TFM offers various shapes, including tablets, granules, rods, and wires. Custom forms and quantities are available upon request. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and information on other materials, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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