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Nickel-Sputtering-Target

ST0032 Nickel Sputtering Target, Ni

Chemical Formula: Ni
Catalog Number: ST0032
CAS Number: 7440-02-0
Purity: 99.9%, 99.99%, 99.995%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Nickel sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Nickel Sputtering Target Description

NickelNickel sputtering targets are made from high-purity nickel metal. The element nickel, symbolized as “Ni,” derives its name from the German term ‘kupfernickel,’ meaning either devil’s copper or St. Nicholas’s copper. First mentioned in 1751 by F. Cronstedt, who also successfully isolated it, nickel has an atomic number of 28 and is located in Period 4, Group 10 of the periodic table, within the d-block. Its relative atomic mass is 58.6934(2) Daltons, with the number in parentheses indicating the measurement’s uncertainty.

Nickel Sputtering Target Specification

Material TypeNickel
SymbolNi
Color/AppearanceLustrous silvery metal
Melting Point1455 °C
Density8.902 g/cm3
Thermal Conductivity90.9 W·m-1·K-1  (25°C)
Electrical Resistivity69.3 nΩ·m (20 °C)
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Nickel Sputtering Target Bonding Services

Specialized bonding services for Nickel Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Nickel Sputtering Target Application

Nickel sputtering targets are widely used in thin film deposition for applications such as decoration, semiconductors, displays, LEDs, and photovoltaic devices. They also play a crucial role in functional coatings, optical information storage, the glass coating industry—including automotive and architectural glass—and optical communications.

Other key applications of nickel include:

  • Alloying Element: Nickel is used in stainless steel, alloy steel, non-ferrous metals, and other corrosion-resistant alloys.
  • Catalyst: It serves as a catalyst in the hydrogenation of vegetable oils.
  • Ceramics Manufacturing: Nickel is used in the production of ceramics.
  • AlNiCo Magnets: These are powerful magnets made from aluminum, nickel, and cobalt.
  • Batteries: Nickel is essential in rechargeable batteries, such as nickel-cadmium and nickel-metal hydride batteries, commonly used in mobile phones and personal stereo devices.
  • High-Purity Nickel Applications: It is used in the electronics and aerospace industries, as well as in chemical and food processing equipment. High-purity nickel is also found in anodes and cathodes, caustic evaporators, and heat shields.

Nickel Sputtering Target Packaging

Our Nickel Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Nickel Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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