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Nickel Sputtering Target

ST0032 Nickel Sputtering Target, Ni

Chemical Formula: Ni
Catalog Number: ST0032
CAS Number: 7440-02-0
Purity: 99.9%, 99.99%, 99.995%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Nickel sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Niobium Silicide Sputtering Target

Introduction

Niobium Silicide (NbSi₂) Sputtering Target is a high-performance ceramic-metallic material designed for thin film deposition in semiconductors, electronics, and advanced research applications. Combining the refractory properties of niobium with the semiconducting and structural characteristics of silicon, NbSi₂ thin films exhibit excellent hardness, thermal stability, and oxidation resistance. This makes the material particularly valuable for protective coatings, microelectronics, and functional device research.

Detailed Description

Niobium Silicide sputtering targets are manufactured using high-purity NbSi₂ powder consolidated by hot pressing or vacuum sintering. The resulting targets feature dense microstructures, low porosity, and high purity, ensuring consistent sputtering rates and uniform thin film quality.

  • Chemical Formula: NbSi₂

  • Purity: 99.9% (3N) or higher on request.

  • Appearance: Dark gray, ceramic-like solid.

  • Forms & Dimensions: Available as circular (25–300 mm), rectangular, and custom designs. Typical thickness: 3–6 mm.

  • Bonding Options: Indium or elastomer bonding to copper/titanium back plates to enhance thermal management and minimize cracking.

  • Properties: High melting point (~1,950 °C), high hardness, stable in oxidizing environments, and good adhesion.

Applications

Niobium Silicide sputtering targets are applied in:

  • Semiconductors – Conductive and barrier layers in integrated circuits.

  • Protective Coatings – Wear-resistant and oxidation-resistant films.

  • Microelectronics – Thin films for transistors, diodes, and MEMS devices.

  • Optical & Functional Coatings – High-stability coatings for optical components.

  • R&D – Advanced studies in refractory silicides, superconductivity, and high-temperature materials.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity≥ 99.9%Ensures clean thin films with minimal contamination
Diameter25 – 300 mm (custom)Compatible with a wide range of sputtering systems
Thickness3 – 6 mmInfluences deposition rate and sputtering stability
BondingCopper / Titanium backingEnhances heat transfer and prevents target cracking
Melting Point~1,950 °CHigh thermal stability for demanding applications

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Niobium Silicide (NbSi₂)High hardness & oxidation resistanceProtective and functional coatings
Titanium Silicide (TiSi₂)Low resistivity, good for contactsSemiconductor interconnects
Molybdenum Silicide (MoSi₂)Excellent high-temp oxidation stabilityHeating elements, protective films

FAQ

QuestionAnswer
Can NbSi₂ targets be customized?Yes, dimensions, thickness, and bonding can be tailored to system requirements.
What is the typical lead time?Standard production time is 2–3 weeks depending on specifications.
Is NbSi₂ brittle?Yes, it is a ceramic material and requires careful handling during installation.
How is it packaged?Vacuum-sealed, cushioned with protective foam, and shipped in export-grade cartons or wooden crates.
Which industries use NbSi₂ the most?Microelectronics, semiconductors, optics, and high-temperature materials R&D.

Packaging

Niobium Silicide sputtering targets are vacuum-sealed to prevent oxidation and contamination. Each unit is carefully packed in foam-protected cartons or wooden crates with clear labeling for traceability and safe handling.

Conclusion

Niobium Silicide Sputtering Targets combine refractory strength, thermal stability, and oxidation resistance, making them ideal for advanced thin film deposition in semiconductors, protective coatings, and R&D. With customizable purity, size, and bonding options, NbSi₂ targets are a reliable solution for both research and industrial production.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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Ni Target 4N ø2"×1mm, Ni Target 4N ø75*5mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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