Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
nickel-zirconium-evaporation-material-1

VD0644 Nickel Zirconium Evaporation Materials, Ni/Zr

Catalog No.VD0644
MaterialNickel Zirconium (Ni/Zr)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) stands out as a premier producer and distributor of high-purity nickel zirconium evaporation materials. Our extensive range includes both powder and granule forms of evaporation materials, with customization options available to meet specific needs.

MSDS File

Nickel Zirconium Evaporation Materials Description

TFM provides high-purity nickel zirconium evaporation materials, an alloy composed of nickel (Ni) and zirconium (Zr). These materials are crucial in deposition processes, ensuring the production of high-quality films. We specialize in producing nickel zirconium materials with up to 99.9995% purity, employing rigorous quality assurance measures to ensure product reliability.

Related Products: Nickel Evaporation Materials, Zirconium Evaporation Materials

Applications of Nickel Zirconium Evaporation Materials

Nickel zirconium evaporation materials are used in a range of advanced applications, including:

  • Deposition processes such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics applications, including wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

We take great care in handling our nickel zirconium evaporation materials to prevent any damage during storage and transportation, preserving the quality and integrity of our products.

Contact Us

As a leading manufacturer and supplier of high-purity nickel zirconium evaporation materials, TFM offers these products in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities are also available upon request. In addition, TFM provides evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about materials not listed, please contact us directly.

Reviews

There are no reviews yet.

Be the first to review “VD0644 Nickel Zirconium Evaporation Materials, Ni/Zr”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

Shopping Cart
Scroll to Top