Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
niobium-diboride-nbb2-sputtering-target-removebg-preview

ST0518 Niobium Diboride Sputtering Target, NbB2

Chemical Formula: NbB2
Catalog Number: ST0518
CAS Number: 12007-29-3
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Niobium Diboride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Niobium Diboride Sputtering Target Description

niobiumNiobium is a silver-colored metal often found in conjunction with tantalum, with the two elements typically separated by fractional crystallization of their fluoro-complexes. It has an abundance of 20 ppm in the Earth’s crust. In its pure form, niobium is highly reactive and forms an extremely stable oxide when exposed to air, significantly enhancing its corrosion resistance. Additionally, niobium reacts with various non-metals at elevated temperatures.

Related Product: Niobium Sputtering Target.

Niobium Diboride Sputtering Target Specifications

Material TypeNiobium Diboride
SymbolNbB2
Color/AppearanceSolid
Melting Point/
Density6.97 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Niobium Diboride Sputtering Target Applications

Superconductors: Niobium Diboride (NbB₂) is highly valued for its superconducting properties, making it essential in the development of superconducting materials and devices, such as superconducting wires, magnets, and energy storage systems.

High-Temperature Materials: Thanks to its exceptional stability at high temperatures, NbB₂ is used in critical applications exposed to extreme heat, including aerospace components, rocket nozzles, and other high-temperature environments.

Abrasion Resistance: NbB₂’s high hardness and wear resistance make it crucial for protecting materials against abrasion and wear, commonly used in cutting tools, drills, and bearings.

Electronic Devices: NbB₂ thin films play a significant role in electronic and semiconductor devices, used in thin-film resistors, capacitors, and integrated circuits, advancing electronic technology.

Optical Coatings: NbB₂ coatings are valuable in optical applications, serving as anti-reflective coatings and protective layers for lenses and mirrors designed for extreme environments, ensuring optimal performance and durability.

Niobium Diboride Sputtering Target Packing

Your Niobium Diboride Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. We take great care to prevent any damage during storage and transportation, ensuring that the products reach you in perfect condition.

Reviews

There are no reviews yet.

Be the first to review “ST0518 Niobium Diboride Sputtering Target, NbB2”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top