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ST1005 Niobium-doped Titanium Dioxide Sputtering Target, TiO2-Nb

Chemical FormulaTiO2-Nb
Catalog No.ST1005
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

With deep expertise in materials science, TFM offers Niobium-doped Titanium Dioxide Sputtering Targets renowned for their exceptional purity. We are dedicated to providing customized solutions and competitive pricing to meet the specific needs of nanotechnology and thin-film deposition applications.

MSDS File

Niobium-doped Titanium Dioxide Sputtering Target Description

Niobium-doped Titanium Dioxide Sputtering Targets are known for their excellent chemical stability, preserving their structure and properties across diverse environmental conditions. The combination of Titanium Dioxide and Niobium enhances sputtering efficiency, leading to higher deposition rates in thin film applications. Thanks to Titanium Dioxide’s optical characteristics, these sputtering targets excel in optical thin film coatings and optoelectronic device fabrication. The incorporation of Niobium further improves the material’s electrical properties, making it highly suitable for electronic device production. Additionally, Niobium-doped Titanium Dioxide Sputtering Targets are versatile and compatible with various substrates, such as glass and silicon, broadening their application potential.

Related Product: Titanium Sputtering Target, Aluminum Titanium Sputtering Target

Niobium-doped Titanium Dioxide Sputtering Target Specifications

Compound FormulaTiO2-Nb
AppearanceBlack Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Niobium-doped Titanium Dioxide Sputtering Target Handling Notes

Indium bonding is advised for Niobium-doped Titanium Dioxide Sputtering Targets due to their inherent properties, such as brittleness and low thermal conductivity, which make them less suitable for traditional sputtering methods. These targets have low thermal conductivity and are prone to thermal shock, making indium bonding an effective solution to enhance their performance and durability.

Niobium-doped Titanium Dioxide Sputtering Target Application

Optical Film Coating: Niobium-doped Titanium Dioxide Sputtering Targets are ideal for creating high-performance optical films, including reflective, transparent conductive, and anti-reflective films.

Electronics: These targets excel in producing electronic devices, such as optoelectronic devices and sensors, thanks to the enhanced electrical properties imparted by niobium.

Optoelectronics: With their superior optical characteristics, Niobium-doped Titanium Dioxide Sputtering Targets are utilized across various optoelectronic applications, including solar cells and other optoelectronic devices.

Conductive Coatings: They are well-suited for fabricating conductive coatings, which find extensive use in electronics, optics, and display technologies.

Niobium-doped Titanium Dioxide Sputtering Target Packaging

Our Niobium-doped Titanium Dioxide Sputtering Targets are meticulously managed throughout storage and transportation to maintain their quality and ensure they remain in optimal condition.

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TFM provides Niobium-doped Titanium Dioxide Sputtering Targets in various forms, purities, and sizes. We specialize in high-purity physical vapor deposition (PVD) materials, ensuring the highest density and smallest average grain sizes. Our targets are designed for use in semiconductor applications, chemical vapor deposition (CVD), and physical vapor deposition (PVD) for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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