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ST0068 Aluminum Titanium Sputtering Target, Al/Ti

Chemical Formula: Al/Ti
Catalog Number: ST0068
CAS Number: 12004-39-6
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum  Titanium  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Aluminum Titanium Sputtering Target Description

The aluminum titanium sputtering target from TFM is a silvery alloy sputtering material composed of aluminum (Al) and titanium (Ti).

Aluminum

Aluminum:

Aluminum, also known as aluminium, is a chemical element derived from the Latin name for alum, ‘alumen,’ meaning bitter salt. It was first mentioned in 1825 by H.C. Ørsted, who successfully observed and isolated it. The chemical symbol for aluminum is “Al,” and it has the atomic number 13. Aluminum is located in Period 3 and Group 13 of the periodic table, within the p-block. The relative atomic mass of aluminum is 26.9815386(8) Dalton, with the number in brackets indicating the uncertainty.

Related Product: Aluminum Sputtering Target

Titanium

Titanium:

Titanium is a chemical element named after the Titans, the sons of the Earth goddess in Greek mythology. It was first mentioned in 1791 and observed by W. Gregor, with its isolation later accomplished and announced by J. Berzelius. The chemical symbol for titanium is “Ti,” and it has the atomic number 22. Titanium is located in Period 4 and Group 4 of the periodic table, belonging to the d-block. The relative atomic mass of titanium is 47.867(1) Dalton, with the number in brackets indicating the uncertainty.

Related Product: Titanium Sputtering Target

Aluminum Titanium Sputtering Target Bonding Service

Specialized bonding services for Aluminum Titanium Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Aluminum Titanium Sputtering Target Packaging

Our aluminum titanium sputtering targets are carefully handled to prevent any damage during storage and transportation, ensuring that the quality of our products is preserved in their original condition.

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TFM offers Aluminum Titanium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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