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Niobium Oxide (Nb2Ox) Rotary Sputtering Target

Product Overview

Niobium Oxide (Nb2Ox) Rotary Sputtering Target (Nb2Ox) in rotary format is designed for cylindrical cathodes used in large-area or continuous magnetron sputtering systems. Compared with a conventional planar target, a rotary design can improve material utilization and support longer coating runs, provided that the target dimensions, wall thickness, bonding or backing-tube design, and cathode compatibility are correctly specified.

Material and Deposition Characteristics

Rotary target performance depends not only on material chemistry but also on cylindrical geometry, target wall thickness, target-to-backing interface, end machining, and cooling design. For metallic rotary assemblies, DC magnetron sputtering is commonly used, while process parameters should still be qualified against the specific cathode and the required film properties. A correct mechanical fit is critical because small dimensional deviations can affect installation, rotation stability, and coating uniformity.

Technical Data

MaterialsNiobium Oxide Rotary Sputtering Target
SymbolNb₂Ox (4.3 < x < 4.9)
Purity≥99.95%
Melting Point (°C)N/A
Production MethodSpraying Type / Bonded Type (Cold isostatic pressing + high-temperature sintering)
Backing TubeTitanium, Stainless Steel
Bonding MaterialIndium or Elastomer
SizeAs per customer’s drawings
Relative Density≥95% (≥4.3 g/cm³)
Resistivity (Ω·cm)≤0.1
Annual Capacity1,000 tons

Typical Thin-Film Applications

  • Large-area inline or continuous magnetron coating lines
  • Architectural glass, display, solar, and industrial web-coating processes that use cylindrical cathodes
  • Production environments where long runs, high target utilization, and coating uniformity are important

Target Configuration and Ordering Considerations

For a rotary target quotation, provide overall length, outer diameter, inner diameter or wall thickness, backing-tube material and dimensions, end features, purity or composition, quantity, and the cathode model or drawing if available. If a replacement target is being sourced, photos or a dimensioned sketch of the old assembly can help confirm compatibility.

Frequently Asked Questions

When is a rotary Niobium Oxide (Nb2Ox) Rotary target preferred over a planar target?

A rotary target is mainly selected for cylindrical cathodes and longer production runs where higher target utilization, stable erosion, and reduced target-change frequency are priorities. The benefit depends on the coating line and cathode design.

What dimensions are required to quote a rotary Niobium Oxide (Nb2Ox) Rotary target?

Key dimensions include target length, outer diameter, inner diameter or wall thickness, end geometry, backing-tube details, purity or composition, and quantity. A drawing or old-target sample is helpful for confirming compatibility.

Does a rotary Niobium Oxide (Nb2Ox) Rotary target require bonding or a backing tube?

Many rotary assemblies use a backing tube, bonded interface, or sprayed/coated construction. The correct design depends on target material, cathode cooling, operating power, and the specific cathode hardware.

Can Niobium Oxide (Nb2Ox) Rotary be sputtered with DC power?

If the target material is electrically conductive, DC magnetron sputtering is commonly used. The final operating mode and power density should still be confirmed against the actual cathode and film requirements.

Why is fit-up important for a rotary target assembly?

Small dimensional deviations can affect rotation, cooling, mechanical stability, installation, and film uniformity. Rotary targets therefore require closer coordination between target dimensions and cathode specifications.

What should be included in a rotary target RFQ?

Include target dimensions, material purity or composition, cathode or backing-tube details, end features, quantity, and any inspection, tolerance, or documentation requirements.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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