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Niobium Oxide Rotary Sputtering Target

Niobium Oxide (Nb2Ox) Rotary Sputtering Target

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Introduction

TFM provides high-quality Niobium Oxide Rotary Sputtering Target, ideal for thin film deposition applications in advanced electronics and optoelectronics. These targets are primarily used in the production of niobium oxide films, which offer superior optical properties, high thermal stability, and excellent electrical characteristics.

Niobium oxide films are widely used in capacitors, optical coatings, and thin-film resistors, as well as in superconducting materials and thin-film devices. The rotary sputtering target design ensures efficient and uniform deposition of Nb₂Oₓ films, making them suitable for large-scale production and precise thin-film applications. These targets are also valued for their high-density composition and minimal impurity levels, ensuring high-quality, consistent film deposition.

TFM offers customized Niobium Oxide Rotary Sputtering Target to meet specific application needs, providing optimal performance for industries such as semiconductors, solar energy, and coatings. With precise material control, these targets ensure reliable, high-quality results in a wide range of thin-film deposition processes.

Niobium Oxide (Nb2Ox) Rotary Sputtering Target Specifications

MaterialsNiobium Oxide Rotary Sputtering Target
SymbolNb₂Ox (4.3 < x < 4.9)
Purity≥99.95%
Melting Point (°C)N/A
Production MethodSpraying Type / Bonded Type (Cold isostatic pressing + high-temperature sintering)
Backing TubeTitanium, Stainless Steel
Bonding MaterialIndium or Elastomer
SizeAs per customer’s drawings
Relative Density≥95% (≥4.3 g/cm³)
Resistivity (Ω·cm)≤0.1
Annual Capacity1,000 tons

Applications

  • Thin Film Photovoltaic Solar Industry
  • Semiconductor Electronics Industry
  • TFT-LCD Coating
  • Construction / Automotive Glass Industry

For further inquiries or to request customized specifications, please contact TFM.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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