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ST0180 Niobium Oxide Sputtering Target, Nb2O5

Chemical Formula: Nb2O5
Catalog Number: ST0180
CAS Number: 1313-96-8
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Niobium Oxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Niobium Oxide Sputtering Target Description

The Niobium Oxide Sputtering Target from TFM is an oxide sputtering material composed of niobium (Nb) and oxygen (O). This material is widely used in various applications, including thin-film deposition and electronic components, due to its unique properties and performance characteristics.

niobiumNiobium, symbolized as “Nb,” is a chemical element named after Niobe, the daughter of King Tantalus from Greek mythology. It was first mentioned in 1801 and observed by C. Hatchett. The isolation of niobium was later accomplished and announced by W. Blomstrand. Niobium has an atomic number of 41 and is located in Period 5, Group 5 of the periodic table, within the d-block. Its relative atomic mass is 92.906 38(2) Dalton, with the number in brackets indicating the measurement uncertainty. Niobium is widely used in alloys, particularly in stainless steel, and in superconducting materials.

Related Product: Niobium Sputtering Target

OxygenOxygen, represented by the symbol “O,” is a chemical element named from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first described and observed by W. Scheele in 1771, who also successfully isolated it. Oxygen has an atomic number of 8 and is positioned in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the uncertainty. Oxygen is essential for life, playing a crucial role in respiration, combustion, and various chemical processes, and it is a key component of water, organic compounds, and the Earth’s atmosphere.

Niobium Oxide Sputtering Target Specification

Material TypeNiobium (V) Oxide
SymbolNb2O5
Molecular Weight265.81
Color/AppearanceWhite, Crystalline Solid, Grey-Black
Melting Point (°C)1,485
SputterRF, RF-R
Type of BondIndium, Elastomer
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

 

Niobium Oxide Sputtering Target Bonding Service

Specialized bonding services for Niobium Oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Niobium Oxide Sputtering Target Packaging

Our Niobium Oxide (Nb2O5) Sputtering Target is meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. We take great care in handling and packaging to prevent any damage during storage and transportation, ensuring that the targets arrive in excellent condition and retain their high quality for optimal performance in various applications.

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TFM offers Niobium Oxide (Nb2O5) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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