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ST0033 Niobium Sputtering Target, Nb

Chemical Formula: Nb
Catalog Number: ST0033
CAS Number: 7440-3-1
Purity: 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Niobium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Niobium Sputtering Target Description

niobiumNiobium sputtering targets retain the properties of their source material, niobium. This silver-colored metal is typically found alongside tantalum, with the two elements being separated through the fractional crystallization of their fluoro-complexes. Niobium is relatively abundant, comprising about 20 parts per million (ppm) of the Earth’s crust. As a pure metal, niobium is highly reactive and forms a very stable oxide layer when exposed to air, significantly enhancing its corrosion resistance. Additionally, niobium can react with various non-metals at elevated temperatures.

Niobium Sputtering Target Specification

Material Type Niobium
Symbol Nb
Atomic Number 41
Color/Appearance Gray, Metallic
Melting Point 2,468 °C
Density 8.57 g/cc
Sputter DC
Type of Bond Indium, Elastomer
Comments Attacks W source.
Target Dimensions & Thickness Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Niobium Sputtering Target Application

Niobium sputter targets are essential for thin film deposition in various applications, including fuel cells, decoration, semiconductors, displays, LEDs, photovoltaic devices, and glass coating. Beyond these uses, niobium has several other significant applications:

Steel Production Niobium is an effective microalloying element in steel, forming niobium carbide and niobium nitride. These compounds enhance grain refinement and slow down recrystallization and precipitation hardening processes. Niobium alloys are commonly used in pipeline construction due to these properties.

Superalloys Niobium is used in nickel-, cobalt-, and iron-based superalloys in quantities up to 6.5%. These superalloys are critical for jet engine components, gas turbines, rocket subassemblies, turbocharger systems, and heat-resistant combustion equipment. Niobium helps to precipitate a hardening γ”-phase within the grain structure of the superalloy, increasing its durability and performance.

Superconducting Magnets Niobium is used in the creation of type II superconductor wires, such as niobium-germanium (Nb3Ge), niobium-tin (Nb3Sn), and niobium-titanium alloys. These superconducting magnets are vital components in magnetic resonance imaging (MRI) machines, nuclear magnetic resonance (NMR) instruments, and particle accelerators.

Niobium Sputtering Target Bonding Services

Specialized bonding services for Niobium Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packing

Our Niobium Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Niobium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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