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VD0567 Palladium Evaporation Materials, Pd

Material Type: Palladium
Symbol: Pd
Z Ratio: 0.357
Shape: Powder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity palladium evaporation materials, as well as a diverse range of other evaporation products. We offer these materials in both powder and granule forms, with customization options available to meet specific needs.

 

MSDS File

Palladium Evaporation Material Description

Palladium is a silvery-white transition metal known for its softness, ductility, and plasticity. It is a member of the platinum group of elements, located in group VIII of the fifth period on the periodic table, and is represented by the symbol Pd. The platinum group metals (PGMs), which include palladium, platinum, rhodium, ruthenium, iridium, and osmium, share similar chemical properties. Among these metals, palladium stands out for having the lowest melting point and the least density.

High-purity palladium evaporation materials are essential for achieving top-quality deposited films in various deposition processes. TFM is dedicated to producing palladium evaporation materials with purities reaching up to 99.95%, ensuring product excellence through stringent quality control measures.

palladium evaporation materials

Palladium Evaporation Material Specification

Material TypePalladium
SymbolPd
Melting Point1,554 °C
Color/AppearanceSilvery White Metallic
Theoretical Density12.02 g/cc
Z Ratio0.357
SynonymsPd Pellets, Pd Pieces, Pd Evaporation Pellet, Palladium Pellets, Palladium Pieces, Palladium Evaporation Pellet

Palladium Evaporation Material Application

These materials are integral to various deposition processes, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). In the field of optics, they are employed for a range of applications such as enhancing wear resistance, creating decorative coatings, and developing advanced display technologies.

Palladium Evaporation Material Packaging

We ensure that our palladium evaporation materials are carefully managed to avoid any damage during storage and transportation, maintaining the products in their original, high-quality condition.

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TFM offers palladium evaporation materials in a range of forms, purities, sizes, and price points. We focus on producing high-purity e-beam evaporation materials, designed to provide maximum density and minimal average grain sizes. For up-to-date pricing on evaporation pellets and other deposition materials not listed, please contact us with your inquiry.

 

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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