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ST0034 Palladium Sputtering Target, Pd

Chemical Formula: Pd
Catalog Number: ST0034
CAS Number: 7440-5-3
Purity: 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

MSDS File

Palladium Sputtering Target Description

Palladium

Palladium sputtering targets exhibit the same properties as their source material, palladium. As a member of the platinum group of metals, palladium is a lustrous silver-white metal with a face-centered cubic crystalline structure. At normal temperatures, it is highly resistant to corrosion from air and most acids. However, it can be attacked by hot acids and dissolves in aqua regia. Palladium forms numerous compounds and several complex salts.

This metal is known for its excellent corrosion resistance but is soluble in oxidizing acids and fused alkalis. One notable characteristic of palladium is its ability to absorb hydrogen gas—up to 900 times its own volume. Despite this, its primary use is as a catalyst for hydrogenation processes.

Palladium Sputtering Target Specifications

Material Type Palladium
Symbol Pd
Melting Point 1,554 °C
Color/Appearance Silvery White Metallic
Theoretical Density 12.02 g/cc
Sputter DC
Type of Bond Indium, Elastomer
Comments Can alloy with refractory metals.
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Palladium Sputtering Target Application

High-performance palladium sputtering targets are essential for various thin-film coating applications, including CD-ROM production, decorative coatings, flat panel displays, and functional coatings. They are also used in the optical information storage industry, glass coating industry (such as car and architectural glass), and optical communications.

Other significant applications of palladium metal include:

  • Catalytic Converters: Palladium is a crucial component in catalytic converters, helping to reduce harmful emissions from internal combustion engines.
  • Catalyst in Polyester Production: It plays a key role in the production of polyester, acting as an important catalyst.
  • Emission Reduction: Palladium is used to eliminate harmful emissions from internal combustion engines.
  • Purification of Nitric Acid: It is instrumental in the purification process of nitric acid.
  • Synthetic Rubber and Nylon Production: Palladium aids in the development of raw materials for synthetic rubber and nylon, contributing to these vital manufacturing processes.

Palladium Sputtering Target Bonding Service

Specialized bonding services for Palladium Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Palladium Sputtering Target Handling Notes

Our reclaim service is available for palladium sputter targets and other precious metal products. This service aims to help you reduce material costs by recycling precious metals and spent targets. We are committed to efficient and sustainable recycling practices to maximize the value of your materials.

Packing

Our Palladium Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Palladium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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