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Platinum Evaporation Materials

VD0568 Platinum Evaporation Materials, Pt

Catalog No.VD0568
MaterialPlatinum (Pt)
Purity99.99%
ShapePowder/ Granule/ Custom-made

TFM is a trusted manufacturer of platinum evaporation materials. In addition to our core offerings, we provide a variety of other platinum products, including standard platinum crucibles, platinum wire, low and wide base crucibles, volatile matter crucibles, standard platinum dishes, and platinum accessories like platinum-tipped tongs.

 

MSDS File

Platinum Evaporation Materials

Introduction

Platinum Evaporation Materials are premium-grade sources designed for thin film deposition in advanced research and industrial applications. Known for its exceptional chemical stability, high melting point, and superior catalytic activity, platinum is indispensable in microelectronics, optics, catalysis, and energy systems. Thin films derived from platinum evaporation materials exhibit outstanding durability, corrosion resistance, and electrical conductivity, making them a critical choice for high-performance coatings.

Detailed Description

Platinum evaporation materials are typically supplied in pellets, pieces, slugs, granules, or rods, all manufactured from high-purity platinum (99.95%–99.999%). These materials are compatible with both thermal and electron beam (e-beam) evaporation systems.

Key features include:

  • High Purity (99.95%–99.999%): Ensures defect-free and contamination-free thin films.

  • Excellent Thermal Stability: With a melting point of 1,768 °C, platinum withstands demanding evaporation conditions.

  • Outstanding Corrosion Resistance: Inert to most acids and chemicals, ensuring film longevity.

  • Superior Electrical Conductivity: Provides reliable metallization layers for microelectronics.

  • Catalytic Properties: Useful for thin films in fuel cells, hydrogen sensors, and catalytic converters.

Applications

Platinum evaporation materials are applied in a wide range of industries:

  • Microelectronics & Semiconductors: Metallization layers, diffusion barriers, and contacts.

  • Optical Coatings: Reflective and protective coatings for high-precision optics.

  • Catalysis: Thin films for fuel cells, hydrogen generation, and chemical processing.

  • Energy Devices: Electrodes for solid oxide fuel cells, electrolyzers, and batteries.

  • Medical & Research: Coatings for biomedical devices, sensors, and high-temperature experiments.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.95% – 99.999%High purity ensures reliable thin film performance
Forms AvailablePellets, pieces, rods, slugs, granulesCompatible with different evaporation sources
Melting Point1,768 °CHigh melting point allows stable deposition
Density21.45 g/cm³Contributes to film density and durability
Evaporation MethodThermal / e-beamFlexible for different deposition systems

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Platinum (Pt)Excellent chemical stability & catalytic activitySemiconductors, fuel cells, catalysis
Gold (Au)Highest electrical conductivityMicroelectronics, decoration
Palladium (Pd)Hydrogen absorption & catalytic useSensors, membranes, hydrogen purification

FAQ

QuestionAnswer
What forms are available?Platinum is supplied as pellets, slugs, granules, rods, and custom pieces.
Can it be customized?Yes, purity, size, and form can be tailored for specific evaporation systems.
How is it packaged?Vacuum-sealed or argon-filled containers with protective foam and export-safe cartons.
What is the delivery time?Standard lead time is 2–3 weeks, depending on customization.
Which industries use it most?Semiconductors, optics, catalysis, medical devices, and energy.

Packaging

Platinum evaporation materials are vacuum-sealed or argon-protected to prevent contamination. Each batch is carefully labeled with purity, lot number, and form for full traceability. Export packaging includes protective cartons or wooden crates to ensure safe transport.

Conclusion

The Platinum Evaporation Materials provide unmatched reliability for thin film deposition, offering high purity, excellent stability, and superior catalytic performance. Whether in semiconductors, energy devices, or advanced optics, platinum remains one of the most valuable and versatile evaporation sources available.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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