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VD0568 Platinum Evaporation Materials, Pt

Catalog No.VD0568
MaterialPlatinum (Pt)
Purity99.99%
ShapePowder/ Granule/ Custom-made

TFM is a trusted manufacturer of platinum evaporation materials. In addition to our core offerings, we provide a variety of other platinum products, including standard platinum crucibles, platinum wire, low and wide base crucibles, volatile matter crucibles, standard platinum dishes, and platinum accessories like platinum-tipped tongs.

 

MSDS File

Platinum Evaporation Material Description

Platinum is a dense, malleable, and ductile precious metal with a distinctive silvery-white luster. As the least reactive metal in its group, it exhibits exceptional resistance to corrosion, even at high temperatures. Among the six metals in this group—platinum (Pt), palladium (Pd), osmium (Os), iridium (Ir), rhodium (Rh), and ruthenium (Ru)—platinum is the most prominent. It remains unaffected by oxygen and water, dissolving only in aqua regia or fused alkalis.

TFM has a long-standing expertise in producing high-purity platinum evaporation materials. These materials are critical for achieving high-quality deposited films in various deposition processes. TFM offers platinum evaporation materials with purities of up to 99.95%, ensuring product reliability through stringent quality assurance measures.

Pt evaporation materials

Platinum Evaporation Material Specification

Material TypePlatinum
SymbolPt
Color/AppearanceMetallic Gray
Thermal Conductivity72 W/m.K
Melting Point1,772 °C
Coefficient of Thermal Expansion8.8 x 10-6/K
Theoretical Density21.45 g/cc
Z Ratio0.245
SynonymsPt Pellets, Pt Pieces, Pt Evaporation Pellet, Platinum Pellets, Platinum Pieces, Platinum Evaporation Pellet

Platinum Evaporation Material Application

These materials are employed in various deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). In optics, they are used for applications such as enhancing wear resistance, creating decorative coatings, and advancing display technologies.

Platinum Evaporation Material Packaging

We carefully manage our platinum evaporation materials to avoid any damage during storage and transportation, ensuring that the quality of our products remains intact.

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TFM offers platinum evaporation materials in a range of forms, purities, sizes, and price points. We excel in producing high-purity e-beam evaporation materials with optimal density and minimal average grain sizes. For up-to-date pricing on evaporation pellets and other deposition materials not listed, please contact us with your inquiry.

 

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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