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ST1001 Platinum Iridium Sputtering Target, Pt-Ir

Chemical FormulaPt-Ir
Catalog No.ST1001
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM proudly introduces Platinum Iridium Sputtering Targets, renowned for their exceptional purity. Leveraging our expertise in materials science, we offer customized solutions and competitive pricing to meet the precise requirements of nanotechnology and thin-film deposition.

 

MSDS File

Platinum Iridium Sputtering Target Description

Platinum Iridium Sputtering Targets are essential materials for sputtering deposition processes, where atoms or ions are ejected from the target and deposited onto a substrate to create thin films.

These targets are renowned for their outstanding corrosion resistance, high melting point, and excellent electrical conductivity. The Platinum-Iridium alloy is particularly valuable in high-temperature applications due to its stability and durability. Common uses include thermocouples, electrical contacts, and biomedical devices, where reliable performance and resistance to harsh conditions are crucial.

Related Product: Lead Platinum Sputtering Target, Platinum Ruthenium Sputtering Target

Platinum Iridium Sputtering Target Specifications

Compound FormulaPt-Ir
Molecular Weight387.3
AppearanceSilver Metallic Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Platinum Iridium Sputtering Target Handling Notes

Indium bonding is advised for the Platinum Iridium Sputtering Target because of the material’s inherent brittleness and low thermal conductivity. The low thermal conductivity of Platinum Iridium, coupled with its susceptibility to thermal shock, makes Indium bonding an effective solution to ensure better thermal management and reduce the risk of damage during the sputtering process.

Platinum Iridium Sputtering Target Application

Electronic Manufacturing: Platinum Iridium Sputtering Targets are essential in electronic manufacturing, enabling the production of high-performance electronic devices with their exceptional purity and unique material properties.

Advanced Materials Engineering: These targets are significant in advanced materials engineering, where their distinctive properties contribute to the development of innovative materials with enhanced characteristics.

Nanotechnology Applications: In nanotechnology, Platinum Iridium Sputtering Targets play a crucial role, demonstrating adaptability and supporting advancements in cutting-edge technologies.

Thin-Film Deposition: They are instrumental in thin-film deposition processes, ensuring precise and uniform coatings for various industrial and research applications.

Platinum Iridium Sputtering Target Packaging

Our Platinum Iridium Sputtering Target is meticulously handled during storage and transportation to maintain its quality and ensure it reaches you in optimal condition.

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TFM offers Platinum Iridium Sputtering Targets known for their exceptional purity and performance. With a focus on delivering high-quality targets, TFM ensures precise thin-film deposition for a wide range of applications, including electronics, advanced materials engineering, nanotechnology, and thin-film coatings.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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