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ST0952 Platinum Manganese Sputtering Target, PtMn

Chemical FormulaPtMn
Catalog No.ST0952
CAS Number12339-83-2
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Platinum Manganese sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Platinum Manganese Sputtering Target Description

Platinum Manganese Sputtering Targets ensure precise chemical composition and high purity, which are crucial for thin film preparation. The surface properties and performance of these targets are essential for achieving high-quality, uniform films. The characteristics of the targets are vital for controlling the thin film deposition process. They exhibit magnetic properties, making them suitable for magnetic films and storage applications. Additionally, they provide good electrical conductivity, which is beneficial for preparing conductive films and electronic devices. Their thermal stability also supports reliable performance at elevated temperatures.

Related Product: Platinum Sputtering Target, Lead Platinum Sputtering Target

Platinum Manganese Sputtering Target Specifications

Compound FormulaPtMn
Molecular Weight250.02
AppearanceSilver Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Platinum Manganese Sputtering Target Handling Notes

Indium bonding is recommended for Platinum Manganese Sputtering Targets because of the material’s brittleness and low thermal conductivity, which are not ideal for sputtering. This material’s low thermal conductivity and susceptibility to thermal shock make it important to use appropriate bonding techniques to ensure stability and performance during the sputtering process.

Platinum Manganese Sputtering Target Application

The Platinum Manganese Sputtering Target finds diverse applications in thin film deposition, semiconductor technology, and display manufacturing. It is used in LED production and the development of photovoltaic devices, as well as in the creation of functional coatings and optical data storage. The target also plays a key role in the glass coating sector, including automotive and architectural glass applications. Additionally, it is utilized in optical communication technologies and across various industries, highlighting its significance in advancing multiple technologies and industrial processes.

Platinum Manganese Sputtering Target Packaging

Our Platinum Manganese Sputtering Target is meticulously handled during storage and transportation to maintain the quality of our products in their original condition.

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TFM offers Platinum Manganese Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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