Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
potassium-fluoride-sputtering-target-removebg-preview-1

ST0927 Potassium Fluoride Sputtering Target, KF

Chemical FormulaKF
Catalog No.ST0927
CAS Number7789-23-3
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Potassium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Potassium Fluoride Sputtering Target Description

Potassium Fluoride Sputtering Target is used in the sputtering process, a technique for depositing thin films onto substrates. In this process, high-energy ions bombard the surface of the potassium fluoride sputtering target, causing atoms or molecules to be ejected. These ejected particles then deposit onto a substrate, forming a thin film with properties derived from the target material. The specific shape and size of the sputtering target can vary based on the deposition requirements and equipment used.

Related Product: Potassium Sputtering Target

Potassium Fluoride Sputtering Target Specifications

Compound FormulaKF
Molecular Weight58.10
AppearanceGray target
Melting Point (℃)858
Density (g/cm3)2.48
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Potassium Fluoride Sputtering Target Handling Notes

Indium bonding is recommended for the Potassium Fluoride Sputtering Target due to its characteristics that are not ideal for sputtering. Potassium fluoride exhibits brittleness and low thermal conductivity, making it susceptible to thermal shock during the sputtering process. Indium bonding helps mitigate these issues, ensuring better performance and durability of the sputtering target.

Potassium Fluoride Sputtering Target Application

Potassium Fluoride Sputtering Targets are employed in a range of applications including:

  • Optical Coatings: Potassium fluoride thin films are used in optics for anti-reflective coatings and interference filters, enhancing the performance of optical components by reducing reflections and improving light transmission.
  • Semiconductor Manufacturing: In the fabrication of integrated circuits, potassium fluoride coatings can be used to create precise layers that are critical for the functionality of semiconductor devices.
  • Research and Development: Potassium fluoride coatings find applications in various research and development projects, where their unique properties can be leveraged for innovative solutions and experimentation.

Potassium Fluoride Sputtering Target Packaging

Our Potassium Fluoride Sputtering Target is widely utilized in the production of coatings for a variety of applications, including:

  • Optical Coatings: Enhancing optical performance with anti-reflective coatings and interference filters.
  • Semiconductor Manufacturing: Fabricating precise layers essential for integrated circuits.
  • Research and Development: Supporting diverse R&D applications with its unique properties.

Get Contact

TFM offers Potassium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0927 Potassium Fluoride Sputtering Target, KF”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top