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ST0036A Praseodymium Cerium Manganate Sputtering Targets (Pr(1-x)CexMnO3)

MSDS File
Material TypePraseodymium Cerium Manganate
SymbolPr(1-x)CexMnO3
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Theoretical Density (g/cc)N/A
Water SolubilityInsoluble
SputterRF, RF-R, DC
Type of BondIndium, Elastomer

Praseodymium Cerium Manganate Sputtering Targets

TFM offers premium-quality Praseodymium Cerium Manganate (PrCeMnO₃) sputtering targets, a versatile material that combines the elements of praseodymium, cerium, and manganese to form a perovskite oxide with exceptional properties. Praseodymium Cerium Manganate is highly valued in electronic, magnetic, and catalytic applications due to its unique physical and chemical characteristics.

Key Features and Advantages

  • High Purity – TFM’s Praseodymium Cerium Manganate Sputtering Targets are available with a 99.9% purity to ensure precise deposition and superior film quality.
  • Magnetic Properties – The material exhibits ferromagnetic and antiferromagnetic behaviors, making it ideal for magnetic sensor applications and spintronic devices.
  • Electrochemical Stability – PrCeMnO₃ is highly stable in electrochemical environments, which is critical for energy storage applications such as batteries and supercapacitors.
  • Catalytic Properties – This material also demonstrates catalytic activity, particularly in oxygen reduction reactions and other catalytic processes.
  • Custom Sizes – Targets can be produced in a range of sizes to meet the needs of both industrial-scale manufacturing and small-scale research.
  • Stable Film Deposition – TFM’s sputtering targets ensure uniform and stable film deposition, which results in high-quality films with consistent electrical, optical, and magnetic properties.

Specifications

  • Purity: 99.9%
  • Target Types Available:
    • Circular Targets: Diameter ≤ 14 inches, Thickness ≥ 1mm
    • Block Targets: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Applications

  • Magnetic Materials – Praseodymium Cerium Manganate’s magnetic properties make it suitable for use in magnetic devices, including sensors and magnetic memory storage.
  • Catalysis – The compound’s catalytic activity makes it valuable for catalytic converters, fuel cells, and other electrochemical processes.
  • Energy Storage – PrCeMnO₃ is used in supercapacitors, batteries, and other energy storage devices due to its electrochemical stability and performance in energy conversion applications.
  • Optoelectronics – This material is useful in optical coatings and optoelectronic devices, leveraging its optical and electromagnetic properties.
  • Thin Film Deposition – Praseodymium Cerium Manganate sputtering targets are commonly employed in the deposition of thin films for semiconductor and optical applications.

Manufacturing Process

  • Cold Pressing & Sintering – Our targets are carefully cold-pressed and sintered to achieve optimal density and purity, ensuring uniform deposition during sputtering.
  • Elastomer Bonding – Targets are bonded to a backing plate using elastomeric materials, which improve handling and deposition performance.
  • Cleaning & Packaging – All targets undergo a rigorous cleaning process to remove contaminants and are packaged securely to protect them during transportation.

Options

  • Custom Sizes – TFM offers custom-sized sputtering targets to meet specific needs, whether for large-scale industrial applications or small-scale research.
  • Research and Development – Smaller sizes are available for research and development purposes, supporting innovation and experimentation.
  • Sputtering Target Bonding Service – Enhance target performance with bonding services that improve deposition efficiency and the quality of thin films.

Industry Impact

Praseodymium Cerium Manganate Sputtering Targets are pivotal in a range of advanced material science applications, particularly in spintronics, catalysis, and energy storage. The unique properties of PrCeMnO₃ make it a critical component in the development of magnetic sensors, fuel cells, and energy-efficient devices. TFM’s high-purity targets provide superior film quality for electronic, optoelectronic, and magnetic applications, meeting the stringent demands of industry professionals in research, development, and production.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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