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ST0932 Praseodymium Fluoride Sputtering Target, PrF3

Chemical FormulaPrF3
Catalog No.ST0932
CAS Number13709-46-1
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Praseodymium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Praseodymium Fluoride Sputtering Target Description

The Praseodymium Fluoride Sputtering Target is essential in sputter deposition processes for creating thin films that incorporate praseodymium fluoride. Praseodymium is widely utilized in the production of magnets, lasers, and other advanced technologies.

Sputtering targets are used in sputter deposition, a physical vapor deposition (PVD) method employed to manufacture thin films. In this process, high-energy ions bombard the target material, causing atoms to be ejected. These atoms then deposit onto a substrate, forming a thin film. This technique is commonly used across various industries, including electronics, optics, and coatings, to achieve specific material properties and applications.

 

Praseodymium Fluoride Sputtering Target Specifications

Compound FormulaPrF3
Molecular Weight197.9
AppearanceGreen target
Melting Point (℃)1395
Density (g/cm3)6.3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Praseodymium Fluoride Sputtering Target Handling Notes

Indium bonding is recommended for the Praseodymium Fluoride Sputtering Target because of the material’s inherent challenges, such as brittleness and low thermal conductivity. These characteristics make it prone to thermal shock. Using indium bonding helps mitigate these issues, enhancing the target’s stability and performance during the sputtering process.

Praseodymium Fluoride Sputtering Target Application

The Praseodymium Fluoride Sputtering Target is employed in sputter deposition processes to produce thin films with praseodymium fluoride. These thin films can be utilized in a range of applications, including optical coatings, sensors, and various electronic devices, where the unique properties of praseodymium fluoride are beneficial.

Praseodymium Fluoride Sputtering Target Packaging

Our Praseodymium Fluoride Sputtering Target is extensively used to produce coatings for a range of applications. These coatings can enhance tool wear resistance, increase surface durability, and deliver specific optical or electrical properties, making it a versatile choice for various industrial needs.

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TFM offers Praseodymium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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