Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

ST0036B Praseodymium Nickel Oxide Sputtering Targets (PrNiO)

MSDS File
Material TypePraseodymium Nickel Oxide
SymbolPrNiO
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Theoretical Density (g/cc)N/A
Water SolubilityInsoluble
SputterRF, RF-R, DC
Type of BondIndium, Elastomer

Praseodymium Nickel Oxide Sputtering Targets

TFM offers high-quality Praseodymium Nickel Oxide (PrNiO₃) sputtering targets, a material renowned for its unique electronic, magnetic, and optical properties. Praseodymium Nickel Oxide is a rare perovskite oxide that combines praseodymium and nickel to produce a compound with significant interest in advanced material science applications. This compound is particularly useful in the development of thin films for sensors, electronics, and catalysts.

Key Features and Advantages

  • High Purity – Our Praseodymium Nickel Oxide Sputtering Targets are available with a 99.9% purity, ensuring precise film deposition and reliable performance in thin film applications.

  • Magnetic Properties – PrNiO₃ exhibits magnetoresistance and magnetic properties, making it an ideal choice for spintronic and magnetic sensor applications.

  • Electrochemical Stability – This compound offers excellent stability in electrochemical environments, which is crucial for energy storage devices like supercapacitors and batteries.

  • Optical Properties – Praseodymium Nickel Oxide has optical characteristics that are beneficial for photoelectronic applications, including photodetectors and solar cells.

  • Custom Sizes – Available in various sizes, TFM’s targets cater to both industrial-scale production and small-scale research needs.

  • Stable Performance – TFM’s sputtering targets provide uniform film deposition, ensuring high-quality films with consistent properties.

Specifications

  • Purity: 99.9%

  • Target Types Available:

    • Circular Targets: Diameter ≤ 14 inches, Thickness ≥ 1mm

    • Block Targets: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Applications

  • Magnetic Materials – Praseodymium Nickel Oxide’s magnetic properties make it suitable for spintronic devices, magnetic memory applications, and magnetic sensors.

  • Catalysis – The material’s electrochemical stability and catalytic behavior are valuable in catalytic converters and energy-efficient processes.

  • Optoelectronics – With its optical properties, it is ideal for use in photodetectors, light-emitting devices, and solar energy applications.

  • Energy Storage – PrNiO₃ is used in the development of supercapacitors and batteries due to its stability in electrochemical environments.

  • Thin Film Deposition – Praseodymium Nickel Oxide sputtering targets are used in thin film deposition for high-performance semiconductor devices, including transistors and photovoltaic cells.

Manufacturing Process

  • Cold Pressing & Sintering – Our manufacturing process ensures high density and quality consistency, critical for producing thin films with excellent electrical and magnetic properties.

  • Elastomer Bonding – Targets are bonded to a backing plate to enhance handling and film deposition uniformity.

  • Cleaning & Packaging – Each target undergoes a meticulous cleaning process to ensure it is free from contaminants, followed by careful packaging to protect it from environmental exposure during shipment.

Options

  • Custom Sizes – TFM offers custom-sized targets to meet the requirements of various applications, from research and development to large-scale production.

  • Research and Development – Smaller sizes are available for R&D purposes, enabling testing and prototyping for new applications.

  • Sputtering Target Bonding Service – Enhance the performance of your sputtering targets with target bonding services, which improve the sputtering efficiency and consistency of film deposition.

Industry Impact

Praseodymium Nickel Oxide Sputtering Targets are critical in advanced materials science due to their unique electromagnetic properties. These targets are essential in the development of high-performance electronics, magnetic devices, energy storage systems, and optoelectronic devices. TFM’s high-purity sputtering targets are designed to meet the stringent demands of industries such as semiconductor manufacturing, energy storage, spintronics, and photovoltaics, providing superior performance for both research and commercial applications.

Reviews

There are no reviews yet.

Be the first to review “ST0036B Praseodymium Nickel Oxide Sputtering Targets (PrNiO)”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top