Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Pyrolytic Graphite Sputtering Target

ST0950 Pyrolytic Graphite Sputtering Target, C

Chemical FormulaC
Catalog No.ST0950
CAS Number7440-44-0
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Pyrolytic Graphite sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Pyrolytic Graphite Sputtering Target Description

Pyrolytic Graphite Sputtering Targets are produced from pyrolytic graphite using chemical vapor deposition (CVD). This process, which differs from the hot-pressing method used for standard graphite targets, involves growing the material atom by atom. This results in several advantages:
  • Purity: Impurities are more effectively removed, leading to higher purity.
  • Directionality: The orientation of the material is superior, reducing localized effects and improving sputtering rate.
  • Thermal and Electrical Properties: Enhanced thermal and electrical properties due to a non-porous structure and density close to theoretical values.
  • Outgassing: Faster outgassing is achieved due to the non-porous structure.

Overall, Pyrolytic Graphite Sputtering Targets offer superior high-temperature stability, electrical conductivity, and chemical stability compared to standard graphite targets, making them suitable for more demanding environments.

Related Product: Carbon Sputtering Target, Carbon Graphite Sputtering Target

Pyrolytic Graphite Sputtering Target Specifications

Compound FormulaC
Molecular Weight12.01
AppearanceBlack Target
Melting Point3652℃
Thermal Conductivity140 W/m.K
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Pyrolytic Graphite Sputtering Target Handling Notes

Indium bonding is recommended for Pyrolytic Graphite Sputtering Targets due to the material’s characteristics, which are not ideal for sputtering. These characteristics include brittleness and low thermal conductivity. Pyrolytic graphite has low thermal conductivity and is susceptible to thermal shock, making indium bonding a suitable choice to address these issues.

Pyrolytic Graphite Sputtering Target Application

  • Semiconductor device preparation: Pyrolytic Graphite Sputtering Targets can be used for sputter deposition to prepare semiconductor devices, including thin film transistors (TFTs), photodetectors, and other integrated circuit components.
  • Optoelectronics devices: Due to their high purity and homogeneous structure, Pyrolytic Graphite Sputtering Targets are suitable for preparing high-performance devices in optoelectronics, such as lasers and photodetectors.
  • Conductive film preparation: Pyrolytic Graphite Sputtering Targets can be employed to prepare conductive films for coating various substrates, including glass and plastic, which are used in display technology, touch screens, and similar applications.
  • High-temperature reactor materials: Given the thermal stability of pyrolytic graphite, it is suitable for preparing materials for high-temperature reactors, such as experimental devices for chemical reactions or high-temperature environments.
  • Graphite electrodes: Pyrolytic Graphite Sputtering Targets can be used to prepare graphite electrodes for electrochemical and battery applications, where high conductivity and stability are essential.
  • Conductive coatings: These targets can be applied to coat conductive thin layers for various electronic components and circuits, providing a highly conductive surface.
  • Magnetic materials research: In some cases, Pyrolytic Graphite Sputtering Targets are used to prepare thin films or structures for experiments and studies related to magnetic properties.

Pyrolytic Graphite Sputtering Target Packaging

Our Pyrolytic Graphite Sputtering Target is carefully handled during storage and transportation to maintain its quality in its original condition.

Get Contact

TFM offers Pyrolytic Graphite Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0950 Pyrolytic Graphite Sputtering Target, C”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top