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Rhenium Evaporation Materials

VD0570 Rhenium Evaporation Materials, Re

Catalog No.VD0570
MaterialRhenium (Re)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a leading supplier of ultra-pure rhenium evaporation materials, as well as a broad selection of other evaporation materials. We offer these materials in powder and granule forms, with custom solutions available to address specific requirements.

MSDS File

Rhenium Evaporation Materials

Introduction

Rhenium Evaporation Materials are highly valued for their exceptional thermal stability and unique electronic properties, making them indispensable in thin film deposition. Due to rhenium’s extremely high melting point, strong resistance to creep, and excellent conductivity, these evaporation materials are frequently used in demanding applications such as microelectronics, aerospace coatings, and advanced energy devices.

Detailed Description

Rhenium evaporation materials are typically supplied in the form of pellets, pieces, or granules optimized for electron beam (e-beam) or thermal evaporation processes. Produced from high-purity rhenium (≥99.9%), they ensure minimal contamination and consistent thin film characteristics.

Key features include:

  • Ultra-High Melting Point (3180 °C) – enables stable evaporation in extreme conditions.

  • Excellent Conductivity – supports applications requiring conductive thin films.

  • High Purity – guarantees reproducibility and reliable performance in semiconductor and optical industries.

  • Versatile Forms – available as pellets, granules, and custom-shaped pieces to suit different evaporation systems.

These properties make rhenium particularly attractive for thin films where both electrical and mechanical stability are critical.

Applications

Rhenium evaporation materials are commonly used in:

  • Semiconductor Manufacturing – barrier layers, contacts, and specialized microelectronic films.

  • Optical Coatings – high-reflectivity and durable thin films for optics.

  • Aerospace & Energy – coatings for turbines and high-temperature components.

  • Thin Film Research – advanced material studies requiring rhenium’s unique electronic properties.

  • Superalloy Development – alloying element for strengthening films and coatings.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures minimal contamination
FormPellets, pieces, granulesAdapts to evaporation methods
Particle Size3 – 12 mm (customizable)Matches crucible and e-beam setups
Melting Point3180 °CSuitable for ultra-high-temp films
Density21.02 g/cm³Contributes to uniform evaporation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
RheniumUltra-high melting point, conductivityHigh-temp films, semiconductors
TungstenHigh strength, cost-effectiveGeneral coatings, filaments
MolybdenumLower density, stable at high tempElectronics, optical films

FAQ

QuestionAnswer
In what forms are Rhenium evaporation materials available?Pellets, granules, pieces, or custom shapes based on user needs.
Can Rhenium be evaporated in standard e-beam systems?Yes, it is compatible with both electron beam and thermal evaporation setups.
What industries rely most on Rhenium evaporation materials?Semiconductor, aerospace, energy, and optical coating industries.
How is the material packaged?Vacuum-sealed with moisture-proof packaging, shipped in export-safe cartons or wooden crates.
Can the size and shape be customized?Yes, we provide tailored dimensions and weights to match specific crucible and evaporation requirements.

Packaging

Rhenium evaporation materials are vacuum-packed with inert gas protection to prevent oxidation during transport and storage. Each package is externally labeled for traceability and secured in shock-resistant export cartons or wooden crates to ensure the materials arrive in optimal condition.

Conclusion

Rhenium Evaporation Materials are the ideal choice for applications demanding extreme thermal resistance, high purity, and superior electrical properties. Whether used in semiconductors, optics, or aerospace technologies, rhenium delivers unmatched stability and performance.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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