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VD0571 Rhodium Evaporation Materials, Rh

Material Type: Rhodium
Symbol: Rh
Color/Appearance: Silvery White Metallic
Purity: 99.9% ~ 99.99%
Shape: Powder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity rhodium evaporation materials, as well as a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, and offer customized options to meet specific needs upon request.

Rhodium Evaporation Material Description

Rhodium, symbolized by Rh, is a silver-white, durable metal that belongs to the platinum group. Known for its exceptional reflectivity, rhodium has a melting point higher than platinum but a lower density. The platinum group also includes ruthenium, palladium, osmium, and iridium.

For achieving superior deposited films in various deposition processes, high-purity rhodium evaporation materials are crucial. TFM specializes in producing these materials with purities up to 99.99%, ensuring top-notch quality through stringent quality control measures.

rhodium evaporation materials

Rhodium Evaporation Material Specification

Material TypeRhodium
SymbolRh
Melting Point1,966 °C
Color/AppearanceSilvery White Metallic
Melting Point1,966 °C
Theoretical Density12.41 g/cc
Thermal Conductivity150 W/m.K
Coefficient of Thermal Expansion8.2 x 10-6/K
CommentsE-beam gun preferred.
SynonymsRh Pellets, Rh Pieces, Rh Evaporation Pellet, Rhodium Pellets, Rhodium Pieces, Rhodium Evaporation Pellet

Rhodium Evaporation Material Application

Rhodium evaporation materials are employed in a range of deposition processes, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). In optics, they are used for various purposes such as enhancing wear resistance, creating decorative coatings, and advancing display technologies.

Rhodium Evaporation Material Packaging

We handle our rhodium evaporation materials with great care to prevent any damage during storage and transportation. This meticulous approach ensures that our products maintain their original quality throughout their journey.

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TFM offers rhodium evaporation materials in a range of forms, purities, sizes, and price points. We focus on producing high-purity e-beam evaporation materials, characterized by optimal density and minimal average grain sizes. For the latest pricing on evaporation pellets and other deposition materials not listed, please contact us directly with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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