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VD0572 Ruthenium Evaporation Materials, Ru

Material Type: Ruthenium
Symbol: Ru
Color/Appearance: Gray, Metallic
Purity: 99.9% ~ 99.95%
Shape: Powder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity ruthenium evaporation materials, as well as a diverse selection of other evaporation materials. We provide these materials in both powder and granule forms, and offer customized solutions to meet specific requirements upon request.

MSDS File

Ruthenium Evaporation Material Description

Ruthenium is a hard and brittle light gray polyvalent rare metal represented by the symbol Ru. It is very stable in nature and exhibits strong corrosion resistance, being able to withstand the corrosion of hydrochloric acid, sulfuric acid, nitric acid, and aqua regia at room temperature. Ruthenium is a member of the platinum group metals, which also include rhodium, palladium, osmium, and iridium.

High purity ruthenium evaporation materials are essential in deposition processes to ensure the production of high-quality deposited films. TFM specializes in producing ruthenium evaporation materials with purities of up to 99.95%, utilizing rigorous quality assurance processes to guarantee product reliability.

ruthenium evaporation materials

Ruthenium Evaporation Material Specification

Material TypeRuthenium
SymbolRu
Color/AppearanceGray
Melting Point2334 °C
Density12370 kg/m3
Thermal Conductivity1.17 W·m-1·K-1 (25°C)
Thermal Expansion6.4 µm/(m·K) (25°C)
SynonymsRu Pellets, Ru Pieces, Ru Evaporation Pellet, Ruthenium Pellets, Ruthenium Pieces, Ruthenium Evaporation Pellet

Ruthenium Evaporation Material Application

Ruthenium evaporation materials are used in multiple deposition processes, such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). In optics, they serve various purposes including improving wear resistance, developing decorative coatings, and advancing display technologies.

Ruthenium Evaporation Material Packaging

We handle our ruthenium evaporation materials with the utmost care to prevent damage during storage and transportation. This careful approach ensures that the quality of our products remains intact and is preserved in its original condition.

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TFM offers ruthenium evaporation materials in various forms, purities, sizes, and price ranges. We focus on high-purity e-beam evaporation materials, optimized for maximum density and minimal average grain sizes. For the latest pricing on evaporation pellets and other deposition materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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