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ST0983 Ruthenium Oxide Sputtering Target, RuO2

Chemical FormulaRuO2
Catalog No.ST0983
CAS Number12036-10-1
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Ruthenium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

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Product Overview

Our high-purity Ruthenium Oxide sputtering targets, made from dark black RuO₂, are crucial for thin-film applications in electronics, optics, and energy storage. Ruthenium Oxide is renowned for its outstanding electrical conductivity and stability at elevated temperatures, making it well-suited for challenging industrial uses.

Related Product: Ruthenium Sputtering Target

Specifications

Chemical Formula RuO2
CAS Number 12036-10-1
Purity Options from 99.9% to 99.999%
Molecular Weight 133.07 g/mol
Appearance Solid, dark black
Melting Point 1,200°C
Density 6.97 g/cm³
Sputter RF, DC
Available SizesDiameter up to 14 inches, Thickness ≥ 1 mm; custom sizes available upon request.

Key Properties and Applications

Properties:

  • Conductivity: Ruthenium Oxide is celebrated for its exceptional electrical conductivity, making it ideal for use in electrodes and various electronic applications.
  • High-Temperature Stability: This material maintains its performance even under high temperatures, making it suitable for high-temperature electronic devices.
  • Mechanical Strength: Ruthenium Oxide offers impressive wear and corrosion resistance, which enhances the durability of components coated with this material.

Applications:

  • Electronic Devices: Ruthenium Oxide sputtering targets are pivotal in fabricating electronic devices, where they are used to create conductive films, including electrodes and conductive layers. This is essential for manufacturing high-performance semiconductors, capacitors, and other critical electronic components.
  • Optical Coatings: Due to their excellent optical properties, Ruthenium Oxide sputtering targets are widely utilized in producing optical coatings such as anti-reflective and mirror coatings. These coatings enhance the performance of optical devices.
  • Energy Storage: In energy storage applications, Ruthenium Oxide sputtering targets are crucial for developing high-performance batteries, including supercapacitors and lithium-ion batteries. The material’s conductivity and thermal stability improve battery performance and longevity.
  • Sensor Technology: Ruthenium Oxide is employed in sensor technology, particularly in high-temperature and harsh environments, where its stability and conductive properties make it an ideal choice for reliable sensor materials.
  • High-Temperature Electronic Devices: Thanks to its thermal stability, Ruthenium Oxide sputtering targets excel in producing high-temperature electronic devices, catering to specific environmental requirements.

Customization and Technical Support

We offer customized sizing and composition for Ruthenium Oxide Sputtering Targets tailored to your specifications. Our comprehensive support includes target bonding services with options for Indium and Elastomer bonding. These bonding options are designed to enhance the integration of the targets into your specific setup, ensuring optimal performance and reliability for your applications.

Frequently Asked Questions

Q1: What makes Ruthenium Oxide a preferred material for sputtering targets?
A1: Ruthenium Oxide is favored for sputtering targets due to its excellent electrical conductivity, high-temperature stability, and robust mechanical strength. These properties make it highly suitable for high-performance applications in electronics, energy storage, and optical coatings.

Q2: Can I get Ruthenium Oxide Targets in custom dimensions for my specific application?
A2: Yes, we offer customization options for Ruthenium Oxide Targets, including various dimensions and shapes tailored to your specific deposition systems and application requirements.

Q3: What are common applications of Ruthenium Oxide Sputtering Targets?
A3: Ruthenium Oxide Sputtering Targets are commonly used in the production of electronic components, optical coatings, and electrodes for energy storage devices. They play a key role in enhancing the performance and longevity of these technologies.

Contact Us

TFM offers Ruthenium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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