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ST0248 Samarium Fluoride Sputtering Target, SmF3

Chemical Formula: SmF3
Catalog Number: ST0248
CAS Number: 13765-24-7
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Samarium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Samarium Fluoride Sputtering Target Description

The Samarium Fluoride Sputtering Target is composed of samarium fluoride, an ionic compound that combines the rare earth metal samarium with fluorine. This target is specifically designed for use in sputtering processes across various applications.

Samarium

Samarium, denoted by the symbol “Sm,” is a chemical element named after the mineral samarskite, from which it was first isolated. Discovered by P.E.L. de Boisbaudran in 1879, who also accomplished its isolation, samarium is positioned as element number 62 on the periodic table. It is located in Period 6 and Group 3, classified within the f-block. The atomic mass of samarium is approximately 150.36(2) Dalton, with the numbers in parentheses indicating the uncertainty of this measurement.

Related Product: Samarium Sputtering Target

Fluorine

Fluorine, often referred to as fluorin, is a chemical element derived from the Latin word ‘fluere’, which means to flow. It was first identified by A.-M. Ampère in 1810, and its isolation was later successfully achieved by H. Moissan. Represented by the symbol “F,” fluorine occupies the ninth position on the periodic table and is located in Period 2, Group 17, within the p-block. The atomic mass of fluorine is precisely 18.9984032(5) Dalton, with the numbers in parentheses reflecting the uncertainty of this measurement.

Samarium Fluoride Sputtering Target Specification

Compound FormulaSmF3
AppearanceWhite Solid
Melting Point1,306° C
Boiling Point2,427° C
Density6.60 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Packing

Our Samarium Fluoride Sputter Targets are externally tagged and labeled to ensure precise identification and maintain strict quality control. We take thorough measures to protect these targets from any damage that could occur during storage or transportation, ensuring they reach you in perfect condition.

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TFM offers Samarium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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