Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
🔍
Samarium Oxide Sputtering Target

ST0183 Samarium Oxide Sputtering Target, Sm2O3

Chemical Formula: Sm2O3
Catalog Number: ST0183
CAS Number: 12060-58-1
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Samarium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Samarium Oxide Sputtering Target Description

Samarium Oxide Sputtering Target from TFM is an oxide sputtering material composed of samarium (Sm) and oxygen (O). This material is used in various applications, including thin film deposition and other advanced technologies.

SamariumSamarium is a chemical element named after the mineral samarskite, from which it was first isolated. It was first identified in 1879 by P.E.L. de Boisbaudran, who also accomplished the isolation. The chemical symbol for samarium is “Sm,” and it has an atomic number of 62. Samarium is located in Period 6 and Group 3 of the periodic table, belonging to the f-block. Its relative atomic mass is 150.36(2) Dalton, with the number in brackets indicating the uncertainty.

Related Product: Samarium Sputtering Target

OxygenOxygen is a chemical element that originated from the Greek ‘oxy’ and ‘genes’ meaning acid-forming. It was first mentioned in 1771 and observed by W. Scheele. The isolation was later accomplished and announced by W. Scheele. “O” is the canonical chemical symbol of oxygen. Its atomic number in the periodic table of elements is 8 with a location at Period 2 and Group 16, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, the number in the brackets indicating the uncertainty.

Samarium Oxide Sputtering Target Specification

Compound FormulaSm2O3
Molecular Weight348.8
AppearanceLight yellow
Melting Point2,335° C
Boiling Point4,118° C
Density7600 kg/m-3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Samarium Oxide Sputtering Target Packaging

Our samarium oxide sputtering target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to prevent any damage that might occur during storage or transportation.

Get Contact

TFM offers Samarium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
en en