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ST0040 Samarium Sputtering Target, Sm

Chemical Formula: Sm
Catalog Number: ST0040
CAS Number: 7440-19-9
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Samarium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Samarium Sputtering Target Description

Samarium

The samarium sputtering target is a silvery material composed of high-purity samarium metal. Samarium, symbolized as “Sm,” is named after the mineral samarskite, from which it was first isolated. Discovered in 1879 by P.E.L. de Boisbaudran, samarium has an atomic number of 62 and is located in Period 6 and Group 3 of the periodic table, within the f-block. Its relative atomic mass is 150.36 Daltons, with the number in brackets indicating the measurement uncertainty.

Samarium Sputtering Target Specification

Material Type Samarium
Symbol Sm
Color/Appearance Silvery
Melting Point 1072°C
Density 7353 kg/m3
Thermal Conductivity 0.133 W·m-1·K-1 (25°C)
Electrical Resistivity 88.0 nΩ·m (20 °C)
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Applications of Samarium Sputtering Target

The samarium sputtering target is utilized in:

  • Thin film deposition
  • Decoration
  • Semiconductor manufacturing
  • Displays
  • LED and photovoltaic devices
  • Functional coatings
  • Optical information storage
  • Glass coating for automotive and architectural glass
  • Optical communications

Other Applications of Samarium

  • Catalyst: Used for dehydrogenating and dehydrating ethanol.
  • Medical Uses: The radioactive isotope 153^{153}Sm is used to treat cancer.
  • Nuclear Reactors: Serves as an absorber.
  • Samarium Oxide: Utilized in manufacturing special infrared-absorbing glass for carbon arc-lamp electrodes.
  • Optical Lasers: Employed in doping calcium fluoride crystals used in optical lasers.

Important Notes on Samarium Sputtering Targets

  1. No Bonding Service Available: Currently, bonding services are not offered for the samarium sputtering target.
  2. High Chemical Activity: Samarium targets are highly reactive when exposed to the environment. To prevent chemical reactions, they require oil packaging and a clean procedure during handling and storage.

Samarium Sputtering Target Packaging

Our samarium sputtering targets are meticulously handled to prevent damage during storage and transportation, ensuring they retain their original high quality.

Get Contact

TFM offers Samarium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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