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ST0109 Scandium Aluminum Sputtering Target, Sc/Al

Chemical Formula: Sc/Al
Catalog Number: ST0109
CAS Number: 7440-20-2 | 7429
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Scandium Aluminum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Scandium Aluminum (Sc/Al) Sputtering Target is a high-performance alloy deposition material widely used in advanced thin film technologies. By combining aluminum with scandium, this alloy exhibits improved mechanical strength, thermal stability, and unique electronic characteristics, making it particularly valuable for semiconductor, microelectronics, and functional coating applications.

In Physical Vapor Deposition (PVD) processes such as magnetron sputtering, Sc/Al targets enable the formation of uniform scandium–aluminum thin films or serve as precursor materials for advanced compounds such as scandium-doped aluminum films. These materials are increasingly important in modern electronic devices, piezoelectric materials, and next-generation semiconductor technologies.

Detailed Description

Scandium Aluminum Sputtering Targets are manufactured using high-purity scandium and aluminum metals through controlled alloying processes such as vacuum induction melting, powder metallurgy, or hot isostatic pressing (HIP). These processes ensure homogeneous alloy composition, high density, and stable microstructure—essential factors for consistent sputtering performance.

The addition of scandium significantly enhances the structural and functional properties of aluminum-based thin films. Scandium atoms refine the grain structure of aluminum alloys, improving mechanical strength, thermal stability, and resistance to electromigration. In thin film deposition systems, these properties contribute to improved film reliability and durability.

One of the most important applications of Sc/Al alloy targets is the deposition of scandium-doped aluminum nitride (AlScN) thin films. When used in reactive sputtering processes with nitrogen gas, Sc/Al targets can produce AlScN films that exhibit enhanced piezoelectric properties compared to conventional aluminum nitride films. These materials are widely studied for high-performance sensors, RF devices, and microelectromechanical systems (MEMS).

Sc/Al sputtering targets can be used in DC magnetron sputtering systems, as the alloy remains electrically conductive. High-density targets minimize particle formation and ensure stable deposition rates, which is essential for semiconductor manufacturing and precision thin film applications.

Targets are available in standard circular or rectangular geometries and can also be manufactured according to customer specifications. For larger diameters or high-power sputtering systems, the targets may be bonded to copper backing plates using indium bonding or elastomer bonding to enhance heat dissipation and mechanical stability.

Applications

Thin films deposited from Scandium Aluminum Sputtering Targets are used in a variety of advanced technologies:

  • Piezoelectric thin films – deposition of scandium-doped aluminum nitride (AlScN) for high-performance piezoelectric devices.

  • MEMS and RF devices – improved piezoelectric properties for resonators, filters, and sensors.

  • Semiconductor thin films – conductive or functional layers in microelectronic devices.

  • Aerospace and advanced coatings research – Sc–Al alloy films with enhanced mechanical properties.

  • Microelectronics – alloy thin films used for structural and functional layers in integrated circuits.

  • Materials science research – investigation of scandium-alloy thin films and advanced functional materials.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99% metalsHigher purity improves film quality and electrical performance
CompositionCustom Sc/Al ratiosEnables tuning of mechanical and piezoelectric properties
Density≥99% theoreticalEnsures stable sputtering and reduced particle generation
Diameter25 – 300 mm (custom)Compatible with various sputtering cathodes
Thickness3 – 6 mmInfluences sputtering rate and target lifetime
BondingCopper backing plate (optional)Improves heat transfer and mechanical stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Scandium Aluminum (Sc/Al)Enables high-performance AlScN piezoelectric filmsMEMS, RF filters, sensors
Aluminum (Al)High conductivity and low costGeneral thin film deposition
Aluminum Nitride (AlN)Good piezoelectric propertiesRF devices and acoustic resonators

FAQ

QuestionAnswer
Can the Sc/Al sputtering target composition be customized?Yes, the scandium-to-aluminum ratio can be tailored to meet specific thin film performance requirements.
Which sputtering method is recommended for Sc/Al targets?DC magnetron sputtering is typically used due to the alloy’s electrical conductivity.
Are bonded targets available?Yes, Sc/Al targets can be indium-bonded or elastomer-bonded to copper backing plates for improved thermal management.
What substrates are compatible with Sc/Al thin films?Silicon wafers, sapphire, glass, and various semiconductor substrates are commonly used.
Which industries commonly use Sc/Al sputtering targets?Semiconductor manufacturing, MEMS device fabrication, RF filter production, and advanced materials research laboratories.

Packaging

Our Scandium Aluminum Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

The Scandium Aluminum (Sc/Al) Sputtering Target is a high-value alloy deposition material used for producing advanced thin films with improved mechanical strength, thermal stability, and enhanced piezoelectric performance. Its role in the deposition of scandium-doped aluminum nitride and other advanced alloy thin films makes it increasingly important in modern semiconductor and MEMS technologies.

With customizable compositions, precise manufacturing processes, and reliable bonding options, Sc/Al sputtering targets provide consistent performance for both research and industrial thin film deposition systems.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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