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ST0042A Selenium Oxide Sputtering Targets (SeO2)

Selenium Oxide Sputtering Target (SeO₂)

Introduction

Selenium Oxide Sputtering Targets (SeO₂) are advanced ceramic materials used in thin film deposition processes, especially in research and specialized industrial applications. Known for their unique optical and electronic properties, SeO₂ targets enable the fabrication of high-performance coatings for semiconductors, optics, and emerging energy devices.

Detailed Description

Selenium Oxide is a transparent, hygroscopic oxide with excellent film-forming characteristics. When processed into sputtering targets, it requires careful control of density, purity, and microstructure to ensure consistent deposition performance.

  • Purity: Typically available in 99.9% (3N) and 99.99% (4N), ensuring minimal contamination for sensitive thin film applications.

  • Form: Supplied as circular or rectangular targets, with bonding to copper or titanium backing plates available for high-power sputtering.

  • Microstructure: Fine-grain and high-density processing minimizes cracking and particle release during sputtering.

  • Film Properties: SeO₂ thin films provide excellent transparency, corrosion resistance, and electrical tunability depending on composition and substrate.

Applications

Selenium Oxide Sputtering Targets are applied in multiple fields, including:

  • Optical coatings – transparent, reflective, and anti-reflective layers.

  • Semiconductor devices – dielectric and functional thin films.

  • Energy technologies – advanced photovoltaic and optoelectronic coatings.

  • Protective films – corrosion- and wear-resistant coatings.

  • Research & development – experimental films for photonics and sensor technologies.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Reduces impurities in sensitive films
Diameter25 – 200 mm (customizable)Fits diverse sputtering systems
Thickness3 – 10 mmAffects sputtering rate & stability
BondingIndium / Elastomer / Cu plateImproves heat transfer & mechanical support
FormCircular / RectangularMatches system design

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Selenium Oxide (SeO₂)Optical transparency & tunable filmsPhotonics & R&D
Selenium (Se)High purity semiconductor filmsOptoelectronics
Tellurium Oxide (TeO₂)High refractive indexOptical coatings
Zinc Oxide (ZnO)Transparent conductive oxide (TCO)Displays & solar cells

FAQ

QuestionAnswer
Can Selenium Oxide sputtering targets be customized?Yes, diameter, thickness, purity, and bonding can all be tailored.
Are SeO₂ targets fragile?They are relatively brittle but processed for high density to minimize cracking.
What deposition methods are compatible?Primarily RF magnetron sputtering, due to SeO₂’s insulating nature.
How are targets packaged?Vacuum-sealed with protective foam, shipped in export-safe cartons or wooden crates.
Which industries use SeO₂ films most?Optics, semiconductors, renewable energy, and academic R&D.

Packaging

Selenium Oxide Sputtering Targets are vacuum-sealed under inert gas and cushioned with protective foam to prevent damage. Each unit is labeled with composition, purity, and lot number for quality traceability. Export cartons or wooden crates are used for safe long-distance transport.

Conclusion

Selenium Oxide Sputtering Targets (SeO₂) provide unique optical and electronic advantages for specialized thin film deposition. With customizable dimensions, bonding options, and high-purity grades, they serve as a reliable choice for laboratories and industrial coating systems.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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