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ST0042A Selenium Oxide Sputtering Targets (SeO2)

MSDS File
Material TypeSelenium Oxide
SymbolSeO2
Color/AppearanceWhite Crystals
Melting Point (°C)340
Density3.95 g/cm3
Molecular Weight110.96
Sputter
Exact Mass111.906 g/mol

Selenium Oxide Sputtering Targets

Selenium oxide (SeO₂) is a commonly used compound in sputtering applications. It is a colorless solid produced through the oxidation of selenium, typically by burning in air or reacting with nitric acid or hydrogen peroxide.

Selenium Oxide Sputtering Targets Specifications

  • Purity: 99.99%
  • Circular Targets: Diameter up to 14 inches, Thickness from 1 mm
  • Block Targets: Length up to 32 inches, Width up to 12 inches, Thickness from 1 mm

Applications

  • Ferroelectric
  • Gate Dielectric
  • For CMOS Devices

Features

  • High Purity: With a minimum purity of 99.99%, our Selenium Oxide Sputtering Targets ensure the highest quality for demanding applications.
  • Custom Sizes Available: Targets can be customized to specific requirements for varied sputtering processes.

Manufacturing Process

  • Cold Pressing and Sintering: Our targets are carefully cold-pressed and sintered to ensure consistent density and durability.
  • Elastomer Bonding: Targets are elastomer-bonded to backing plates for better stability during sputtering.
  • Vacuum Cleaning: All targets are thoroughly cleaned for use in vacuum environments, ensuring contamination-free performance.
  • Environmental Protection: The targets are packaged to prevent environmental contamination and ensure safe shipping.

Options

  • 99.99% Minimum Purity: Targets are manufactured with the highest level of purity.
  • Smaller Sizes Available: Custom sizes can be provided, particularly for R&D applications.
  • Sputtering Target Bonding Service: We offer bonding services to enhance the material’s adherence and ensure optimal sputtering results.

Our Selenium Oxide Sputtering Targets are designed for advanced applications in various industries, offering high purity and customizable options to meet your specific needs.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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