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Silicon Chromium Sputtering Target

ST0508 Silicon Chromium Sputtering Target, Si/Cr

Chemical Formula: Si/Cr
Catalog Number: ST0508
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Silicon Chromium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Silicon Chromium Sputtering Target Description

Discover the versatility of Silicon Chromium Sputtering Targets and their wide-ranging uses. This page highlights the essential features and applications of Silicon Chromium in thin film deposition.

Elemental Combination: Silicon and Chromium

Silicon, from the Latin silex or silicis meaning flint, is a crucial element. Isolated by J. Berzelius, it has the symbol “Si” and an atomic number of 14, with an atomic mass of 28.0855(3) Dalton, indicating its uncertainty.

Chromium, a silvery-white, soft, non-magnetic metal, belongs to the boron group. Found in over 270 minerals, it is used in reflective coatings for telescopes, automotive parts, and more, and is essential in aerospace, automotive lighting, OLED, and optical industries.

Related Products: Silicon Sputtering Target, Chromium Sputtering Target.

Silicon Chromium Sputtering Target Specifications

SpecificationDetails
Material TypeSilicon Chromium
SymbolSi/Cr
Color/AppearanceMetallic solid in various forms including powder, sputtering target, foil, bar, plate
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ <br> Thick: 0.125″, 0.250″ <br> Custom shapes and sizes available on inquiry.
PackingTargets are tagged and labeled externally for identification and quality control. Careful handling during storage and transportation.

Silicon Chromium Sputtering Target Applications

Thin Film Deposition: Silicon Chromium sputtering targets are vital for thin film production in semiconductors, chemical vapor deposition (CVD), and physical vapor deposition (PVD) applications for displays and optics.

Coating Creation: Silicon Chromium is used to create reflective coatings for automotive headlamps, mirrors, and telescopes, boosting their performance.

Innovative Industries: Silicon Chromium’s unique properties are leveraged in aerospace, automotive lighting, OLED, and optical industries for advanced technologies.

Silicon Chromium Sputtering Target Advantages

Enhanced Efficiency: Silicon Chromium sputtering targets improve thin film deposition processes, optimizing performance across multiple industries.

Versatile Coatings: Silicon Chromium coatings enhance the quality and functionality of diverse products, including automotive components and telescopes.

Cutting-Edge Technology: Silicon Chromium drives advancements in aerospace, automotive lighting, OLED, and optical technologies.

Harness the potential of Silicon Chromium Sputtering Targets for innovative applications. Contact us today for inquiries and tailored solutions.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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