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Silicon Dioxide Evaporation Materials

VD0724 Silicon Dioxide Evaporation Materials, SiO2

Material Type： Silicon (IV) Oxide
Symbol： SiO2
Color/Appearance： White, Crystalline Solid
Purity：99.9% ~ 99.995%
Shape：Powder/ Granule/ Custom-made

TFM stands out as a premier manufacturer and supplier specializing in high-purity silicon dioxide evaporation materials. We provide a diverse range of evaporation materials, available in both powder and granule forms. Additionally, we offer customized options tailored to specific requirements upon request.

MSDS File

Silicon Dioxide Evaporation Materials Overview

Silicon dioxide, chemically represented as SiO2, is a crucial material in the world of evaporation processes. With a melting point of 1,610°C, a density of 2.648 g/cc, and a vapor pressure of 10⁻⁴ Torr at 1,025°C, silicon dioxide is a highly stable compound. Naturally occurring as sand or quartz, this material is integral in manufacturing glass products, such as windows and bottles. For high-quality film deposition, silicon dioxide’s purity is essential, and our high-purity SiO2 evaporation materials, achieving up to 99.9995% purity, ensure excellent performance in these processes.

Silicon Dioxide Evaporation Materials Specification

Material TypeSilicon Dioxide
SymbolSiO2
Color/AppearanceWhite Solid
Melting Point1,713 °C (3,115 °F; 1,986 K) (amorphous)
Theoretical Density 2.648 (α-quartz), 2.196 (amorphous) g·cm−3
Purity99.9% ~ 99.995%
ShapePowder/ Pellets/ Granule/ Custom-made

Applications of Silicon Dioxide Evaporation Materials

Silicon dioxide evaporation materials are essential for various high-tech applications:

  • Deposition Processes: Utilized in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Applications: Employed in protective coatings, decorative finishes, and display technologies.

Packaging and Handling

To maintain product integrity, our silicon dioxide evaporation materials are carefully tagged and labeled. We ensure protection against damage during storage and transit, adhering to strict quality control measures.

Contact Us

As a premier supplier of high-purity silicon dioxide evaporation materials, we offer a variety of forms including tablets, granules, rods, and wires. Custom shapes and quantities can be tailored to meet specific needs. In addition to evaporation materials, we provide related products such as evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about materials not listed, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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