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ST0986 Silicon Dioxide-Zinc Sulphide Sputtering Target, SiO2-ZnS

Chemical FormulaSiO2-ZnS
Catalog No.ST0986
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Committed to providing exceptional quality while maintaining cost-effectiveness, TFM specializes in Silicon Dioxide-Zinc Sulphide Sputtering Targets. TFM’s dedication to delivering top-tier products guarantees that clients receive the best sputtering targets without sacrificing affordability, making them the go-to choice in the industry.

MSDS File

Silicon Dioxide-Zinc Sulphide Sputtering Target Description

Silicon Dioxide-Zinc Sulphide Sputtering Targets are sophisticated materials used in the sputter deposition process. During sputtering, atoms or molecules are ejected from these targets and deposited onto a substrate to form a thin film. These targets are composed of a combination of Silicon Dioxide (SiO2) and Zinc Sulphide (ZnS), each contributing its own valuable properties.

Silicon Dioxide (SiO2) is renowned for its exceptional transparency and chemical stability, making it ideal for applications where clarity and durability are important. Zinc Sulphide (ZnS), on the other hand, is prized for its optical properties, including its ability to enhance light transmission.

Together, these materials offer a blend of attributes that are highly beneficial for various high-tech applications, including:

  • Optical Coatings: They improve the performance of optical components by enhancing transparency and delivering precise optical properties, essential for applications like anti-reflective coatings and optical filters.
  • Electronic Device Manufacturing: They facilitate the deposition of thin films with specific characteristics required for advanced electronic devices, ensuring reliable performance and functionality.
  • High-Tech Industries: They provide dependable performance in various technological applications where both optical precision and material stability are critical.

These targets are crucial in applications where the combination of transparency, optical characteristics, and stability is essential for the advancement of technology.

Related Product: Aluminum Silicon Copper Sputtering Target, Aluminum Silicon Sputtering Target

Silicon Dioxide-Zinc Sulphide Sputtering Target Specifications

Compound FormulaSiO2-ZnS
Molecular Weight–
AppearanceWhite Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Silicon Dioxide-Zinc Sulphide Sputtering Target Handling Notes

For Silicon Dioxide-Zinc Sulphide Sputtering Targets, Indium bonding is recommended due to specific challenges associated with these materials. The combination of Silicon Dioxide (SiO2) and Zinc Sulphide (ZnS) can present issues such as brittleness and low thermal conductivity, making them less suitable for conventional sputtering techniques.

Silicon Dioxide-Zinc Sulphide targets tend to have low thermal conductivity and can be prone to thermal shock, which can affect their performance during sputtering. Indium bonding helps to address these challenges by providing a more stable and effective method for attaching the target to the sputtering apparatus. This enhances the target’s overall reliability and performance by minimizing issues related to brittleness and thermal instability.

Silicon Dioxide-Zinc Sulphide Sputtering Target Application

Silicon Dioxide-Zinc Sulphide Sputtering Targets are highly versatile materials used across a range of high-tech applications, thanks to their unique properties. Here’s how they are applied in various fields:

  • Optical Coatings: These targets are integral to the deposition of thin films for optical coatings. They are used on lenses, mirrors, and other optical elements to improve light transmission, reduce unwanted reflections, and achieve specific optical characteristics. This enhances the performance of optical components in a variety of applications.
  • Electronics: In electronics, the thin films created using Silicon Dioxide-Zinc Sulphide Sputtering Targets are crucial for the manufacture of semiconductors. The precision and uniformity of these thin films are vital for ensuring optimal performance and reliability of electronic devices.
  • Solar Cells: The sputtering targets are also employed in the production of thin films for solar cells. Their transparency and optical properties play a key role in maximizing light absorption and improving energy conversion efficiency in photovoltaic applications.
  • Photonics and Optoelectronics: The combination of Silicon Dioxide and Zinc Sulphide makes these targets ideal for photonics and optoelectronics. They are used in creating components such as photonic devices, lasers, and light-emitting diodes (LEDs), where precise optical characteristics are essential.
  • Sensor Technologies: Silicon Dioxide-Zinc Sulphide thin films are utilized in sensor technologies, especially those that require specific optical or electronic properties for accurate detection and measurement.

Overall, the distinctive properties of Silicon Dioxide and Zinc Sulphide make these sputtering targets invaluable in advancing technology across these high-tech sectors.

Silicon Dioxide-Zinc Sulphide Sputtering Target Packaging

Our Silicon Dioxide-Zinc Sulphide Sputtering Targets are meticulously managed during both storage and transportation to ensure that they maintain their quality and integrity. Each target is handled with the utmost care to preserve its original condition, ensuring optimal performance and reliability in your applications.

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TFM’s Silicon Dioxide-Zinc Sulphide  Sputtering Target is offered in a variety of forms, purities, and sizes to meet your specific needs. We specialize in manufacturing high-purity physical vapor deposition (PVD) materials, ensuring the highest possible density and the smallest average grain sizes. These targets are ideal for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) applications, including displays and optical components.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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